Webinar: Mobile Internet Device Architectures

Free webinar: Mobile Internet Device (MID) architectures Register now! On August 7, 2008, at 11 a.m. Central time, In-Stat and Texas Instruments will team up to present a series of insights into the technologies and market dynamics that will Unleash the Mobile Internet. The series includes the following: MID market overview (June 26) MID architectures (August 7) MID business model (September) MID ecosystem (November) The first highly attended webinar on the MID market overview provided MID definition and huge potential for this emerging application. A webinar replay is available. Join In-Stat's Jim McGregor, principal analyst and research director, for the second webinar in the series, MID architectures. Jim will be moderating an hour-long webinar featuring a live Q&A discussion with TI's Brian Carlson and other industry participants on the critical topic of hardware and software architectures for this new class of mobile solutions. Among the topics of the discussion are the following: ARM vs. x86 System-on-a-chip vs. multi-chip approach Hardware systems architecture Software systems architecture Don't miss this opportunity to gain a unique understanding of the industry's most promising segments as we address the critical issue of system and solution design. As mobile users increasingly demand "no compromise" wireless Internet solutions, understanding the applications, hardware alternatives, new software requirements, communications technologies, usage models, and evolving business models becomes crucial in this growing and dynamic segment. Register now

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PRiME 2008 - REGISTER NOW!

REGISTRATION IS NOW OPEN! PRiME 2008 / Joint International Meeting 214th ECS Meeting 2008 Fall Meeting of The Electrochemical Society of Japan   And with the Technical co-sponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, The Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry   Hilton Hawaiian Village Beach Resort and the Hawaii Convention Center, Honolulu HI October 12-17, 2008   For more information and to register, please visit our website: http://www.electrochem.org/   Please note these important deadlines for the Hawaii PRiME 2008 Meeting:   1. Meeting and Short Course Registrations are due to ECS Headquarters no later than September 12, 2008 to qualify for the advance registration discount.   Register for the meeting using our online system that processes your Visa, MasterCard, or American Express credit card payment in real time: https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs   If you prefer, send or fax a hard copy of your meeting registration form with payment to ECS at 65 South Main St., Pennington, NJ 08534, USA, Fax: 1.609.737.2743, or E-mail: ecs@electrochem.org, no later than September 12, 2008. You can download the meeting registration brochure at: http://www.electrochem.org/meetings/biannual/214/214.htm      Please Note: All technical registrations include a copy of the meeting abstracts on CD-ROM only. Attendees who wish to have paper copies of abstracts should download them in advance of the meeting from the ECS website: http://ecsmeet2.peerx-press.org/jsp/mas/reportSymposiumList.jsp   2. Hotel reservations must be made by September 12, 2008 to qualify for the discounted meeting rates!  Please follow the link to make a hotel room reservation online: http://www.hilton.com/en/hi/groups/personalized/HNLHVHH-AAM-20081004/index.jhtml  ATTENTION:   Please review the following instructions before registering for PRiME 2008. Electrochemical Society Members (ECS): Please proceed to the registration page(s) by selecting the event(s) you wish to register for.   Electrochemical Society of Japan (ECSJ) and Korean Electrochemical Society (KES) Members who are not members of ECS: Your Societies have provided ECS with your names and email addresses, and you have been entered into our systems. Your default username to enter the registration process will be your email address and your default password will be "password".    Japan Society of Applied Physics (JSAP), Royal Australian Chemical Institute (RACI), and Chinese Society of Electrochemistry (CSE) Members who are not members of ECS: Please visit http://www.electrochem.org/prime/prime_registration.asp to add your information to our database.  Once you have completed creating your user account, you will be able to enter the system with a default username of your email address and a default password of "password".   Attendees who are not members of ECS, ECSJ, JSAP, KES, CSE, or RACI: Please create a user account by visiting https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=verify to register   If you have any questions, comments, or difficulties please contact ECS Customer Service at customerservice@electrochem.org or 609.737.1902 (x104 or x108).  ECS staff are available 08.30 - 16.45 (US Eastern Time) Monday-Friday.   See you at the Hilton Hawaiian Village in October!   www.electrochem.org   Batteries, Fuel Cells, and Energy Conversion · Biomedical Applications and Organic Electrochemistry · Corrosion, Passivation, and Anodic Films · Dielectric and Semiconductor Materials, Devices, and Processing · Electrochemical/Chemical Deposition and Etching · Electrochemical Synthesis and Engineering · Fullerenes, Nanotubes, and Carbon Nanostructures · Nanotechnology, Nanomaterials, and Nanoscience · Physical and Analytical Electrochemistry · Sensors and Displays: Principles, Materials, and Processing

Diamond 2008 Early Registration Deadline

Please open the online version of this message if the HTML is not correctly displayed. DIAMOND 2008 7-11 September 2008 • Sitges, Spain EARLY REGISTRATION DEADLINE: 25 JULY 2008 www.diamond-conference.elsevier.com Register now for Diamond 2008 Join international delegates for a complete review of the latest scientific and technological aspects of vapour grown diamond, natural and synthetic diamond, and related materials such as carbon nanotubes, diamond-like carbon and wide gap nitrides at Diamond 2008 - the 19th European Conference on Diamond, Diamond-Like Materials, Carbon Nanotubes and Nitrides Coverage includes advances in growth techniques in plasma deposition, heteroepitaxy, doping, defects, hydrogen, biological applications, characterization and the development of new applications. An optional tutorial session on 'Diamond growth' and 'Bio functionalisation of diamond surfaces' will be held on the afternoon of 7 September 2008. Full details of the comprehensive oral and poster programmes are available at www.diamond-conference.elsevier.com Register now to save €75 Reduced delegate rates apply until 25 July 2008 only. Register now at: www.diamond-conference.elsevier.com Accommodation Accommodation has been reserved at the Melia Sitges Hotel at specially negotiated rates. For details and to book visit the accommodation pages of the Diamond 2008 website. INVITED SPEAKERS The following experts will present at the conference: Ali BenMoussa, Royal Observatory of Belgium, Belgium - Recent developments on wide bandgap based UV sensors Juergen Biener, Lawrence Livermore National Laboratory, USA - Diamond for fusion applications James Butler, Naval Research Labs, USA - CVD diamond growth mechanisms - revisited John Foord, Oxford University, UK - Electrochemistry of diamond surfaces Masataka Hasegawa, AIST, Japan - Low temperature growth of nano-diamond Robert Hauge, Rice University, USA - Growth of nanotube mats Russell Hemley, Carnegie Institute, USA - High growth rate diamond Dean Ho, North Western University, USA - Drug delivery by nanodiamond Robert Jones, University of Exeter, UK - Dislocations, vacancy aggregates and brown colour of diamond Hiro Kataura, AIST, Japan - Separation of nanotubes H. Kodama , Kanagawa Academy of Science and Technology, Japan - High speed synthesis of amorphous carbon films on polymer substrates Yasuo Koide, National Institute for Materials Science (NIMS), Japan - Photo detectors Anke Krueger, University of Kiel, Germany - Functionalisation of nanodiamond surfaces Christoph Nebel, Fraunhofer Institut für Angewandt Festkörperphysik (IAF), Germany - Bio-sensors from diamond Eiji Osawa, Shinshu University, Japan - Recent progress in nanodiamond Atsuhito Sawabe, Aoyama Gakuin University, Japan - Progress in hetero-epitaxial growth of diamond Thomas Seyller, University of Erlangen, Germany - Production and electronic structure of graphene François Silva, University Paris 13, France - High quality, large surface area, homoepitaxial MPECVD diamond growth Tetsuya Suzuki, Keio University, Japan - High speed synthesis of amorphous carbon films on polymer substrates Akihiko Ueda, Sumitomo Electric Industries, LTD - Field emission devices Wenjun Zhang, City University of Hong Kong, China - Growth, nano-structuring and properties of cBN films Diamond 2008 is organised by Elsevier in association with Diamond & Related Materials. For further information and to request a copy of the final programme brochure visit: www.diamond-conference.elsevier.com or contact em.white@elsevier.com

230+ ways to use a PIC32 MCU

July 15, 2008 FREE MAGAZINE SUBSCRIPTION (PRINT OR DIGITAL) LATEST NEWS 290+ ways to use a PIC32 microncontroller Microchip's Design Challenge Spurs Some Wild Ideas Read more >> Looking for a jumpstart into Zigbee? Here is a treasure trove of resources Read more >> 8-Bit I/O Devices Still Alive... ...But Severely Crippled Read more >> Are Interrupts A Thorn in Your Side? Here are a few ways to ease the pain Read more >> Inches to Millimeters A quicker way to convert measurements Read more >> Dev Kits for Kids Cool projects for what could be a long hot summer Read more >> Altera Snags Tech Award in FPGA Tool Category Nios II Evaluation Kit gets thumbs up from editors & readers Read more >> ADVERTISEMENT Digi-Key On-line Product Training Modules® at digikey.com Digi-Key continues its long-standing commitment to servicing customer needs from prototype to production with its web-based Product Training Modules® hosted on digikey.com. This engineering tool provides information about the latest products and technologies, product datasheets, and inventory. PRODUCTS IN THE NEWS Harness good vibrations with KCF Technologies wireless sensor kit Get fingerprint authentication with Fujitsu biometric sensing kit Transition from flash to lower-cost EPROM with Silicon Labs dev kit Freescale's MCU dev kit includes motion sensing Cymbet thin-film battery evaluation kit allows investigation of solid state technology Natl Semi's LM5118 eval board allows investigation of wide input voltage range buck-boost power converter VIDEOS Microchip PIC32 Starter Kit DEV-monkey Senior Reviews Editor Jon Titus' provides a 2-minute tutorial review of all the kit contents included in this powerful starter kit for design engineers wanting to investigate a 32-bit MCU within the Microchip PIC32 family. Read more >> Freescale Flexus AC MCU family Bridges the gap between 8 & 32-bit development by offering pin, peripheral and tool compatibility Read more >> Luminary Micro Shock N Awe: Four microphones attached to the table's corners, along with multi-lateration enablers Read more >> ADVERTISEMENT Digi-Key, the one-stop-shop for all electronic parts needs Digi-Key is a leading distributor of electronic components with more than 300,000 parts in stock from more than 380 manufacturers. Digi-Key's commitment to service includes same day shipping for 99.9% of orders, quality customer service, and top-notch technical support. DEVELOPMENT RESOURCE SHOWCASE Cypress Semiconductor's PSoC Express Eval Kit The CY3209-ExpressEVK dev kit includes: software/ hardware and examples to help designers learn aspects of PSoC. Microchip's PICkitTM 2 Starter Kit An easy-to-use starter kit enabling users to start writing code and programming with PIC MCUs. Freescale Semiconductor's M5474LITE Dev Kit M5474LITE Linux dev kit provides everything required to develop an embedded Linux design with the MCF547x processor family. Synapse's Pro Network Eval Kit—EK2500 The all-in-one solution for developing mesh wireless control, monitoring network application and featuring instant-on network. Texas Instruments' eZ430-RF2500 Dev Tool A complete USB-based MSP430 wireless dev tool to evaluate the MSP430F2274 microcontroller and CC2500 2.4-GHz wireless transceiver. CSR PLC's BlueCore5 Multimedia Audio Dev Kit Based on CSR's BlueCore5-Multimedia, contains everything required for rapid eval/dev of Bluetooth stereo/mono audio applications. Cypress Semiconductor's EZ-Color Eval Kit Kit is a preprogrammed HB LED color mix board with seven pre-set colors using the CY8CLED16 EZ-Color HB LED Controller. Atmel's ATAVRMC100 Motor Control Eval Kit Dedicated to brushless DC motor control for Hall effect sensor control and sensorless control using Back ElectroMotive Force. Honeywell's HMR3300 Digital Compass Dev Kit Dev kit includes: an RS-232 motherboard with a D9 serial port connector, port cable, AC adapter power supply, and demo software. Future Design's LCD Demo Kit Kit is a reference design for a low cost microcontroller and LCD solution with demo board and example code for several sample applications. ADVERTISEMENT Got recommendations about what kits DEV-monkey should review, kit comments, or want to reply to the DEV-monkey Blog? Connect with DEV-monkey's Senior Reviews Editor, Jon Titus! DEV-monkey POLL - When designing a battery powered device, how important is it to you to design for power efficiency over device performance? - In your current design, the most important criterion is? - How do you generally design the "next generation" of a device? - Which wireless technology interests you most for an MCU-based design? Respond to the latest question and check out past DEV-monkey polls. DEV-monkey Video Check out the latest exclusive DEV-monkey and contributed video clips and submit your videos demonstrating the gadget or cool functionality you've achieved using a dev kit. Most Viewed Kits Rabbit Semiconductor's Bluetooth Application Kit Atmel's Development Kit for AVR(r)/AVR(r)32 Microcontrollers FINE PRINT You are receiving this email because you have requested either a newsletter or a magazine from Reed Business Information. You are currently registered to receive EDN on Development Tools at: rodrigo.picos@uib.es SUBSCRIBE Click here to activate a new FREE email subscription to EDN on Development Tools UNSUBSCRIBE Click here to unsubscribe from this newsletter YOUR PROFILE Click here to change delivery options, email address or register for other newsletters  FREE PRINT SUBSCRIPTION Click here to request your FREE print subscription to EDN CONTACT Karen Field Editorial Director To become an exclusive sponsor of future EDN on Development Tools newsletters, please contact: Judy Hayes or Laura Lang-Dacus. QUESTIONS If you have any technical questions or need further assistance, please contact our Customer support staff Reed Business Information 225 Wyman Street, Waltham, MA 02451 PRIVACY POLICY Click here to view our privacy policy. PRIVACY MANAGER Reed Business Information 2000 Clearwater Drive, Oak Brook, IL 60523 privacymanager@reedbusiness.com Copyright 2008 Reed Business Information, a division of Reed Elsevier Inc.

Exclusive Webcast from Synopsys and EDN

Please register today for these exclusive Webcasts Get the Most Out Of Your HSPICE on Single & Multi-Core Computers Accelerate Circuit Simulation with 2008 HSPICE! Tuesday, July 15, 2008 11:00 am PT/2:00 pm ET 60 minutes (including Q&A) Sponsored by Synopsys, hosted by EDN CLICK HERE TO REGISTER TODAY Over the past few years, Synopsys has sped up HSPICE, achieving industry leading performance while maintaining HSPICE’s “signoff quality” simulation accuracy. Ask The HSPICE R&D Team! Join the Q&A session with our scientists, principle engineers, and senior technical staff members of the HSPICE R&D team!   Dr. Kishore Singhal, Synopsys Scientist Dr. Scott Wedge, Sr. Staff Engineer Ted Mido, HSPICE R&D Group Synopsys Harald Von Sosen – Principle Engineer  To learn more about how these new technologies accelerate your SPICE simulations, please attend this free informative webcast! Who should attend: Design engineers who run analog IC, standard cell, or package/board level simulations. CAD managers interested in learning about the performance improvements in HSPICE  What you will learn: Overview of the performance improvements available in the March and June 2008 releases of HSPICE Single and Multi-Core performance improvements Using compiled 40/45nm transistors models to reduce memory usage & simulation times Accelerating large high accuracy post-layout analog IC simulations Efficiently simulating long multi-gigabit transmission lines & 500 port package models Accelerating CCS cell characterization with Liberty NCX and HSPICE Moderator Cheryl Ajluni, Industry Expert Cheryl has over 12 years experience covering the high-tech industry for such publications as Elec¬tronic Design and Embedded Systems Development and served as Editor in Chief of Wireless Systems Design. Prior to her work in the editorial field Cheryl worked as a Solar Array Engineer for Space Systems/Loral. Cheryl holds a Bachelor of Science degree in physics and mathematics from the University of California, Davis Presenter Christopher Labrecque, HSPICE Marketing Manager, Synopsys Christopher joined the AMS marketing team upon the acquisition of Analog Design Automation Inc. (ADA) by Synopsys in February of 2004. Chris co-founded ADA and worked for six years in executive and management positions within marketing and R&D, developing circuit analysis and optimization products. Chris continues to work closely with customers, sales, and R&D to plan and develop the requirements and business cases for AMS circuit design and simulation tools. Chris holds Bachelor degrees in Engineering Physics and in Computer Science, both from the University of Saskatchewan. Prior to Synopsys and ADA, Chris was employed at Nortel Networks in Ottawa, Canada. CLICK HERE TO REGISTER TODAY