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OSC-08 Second Call for Papers cintelliq ltd, the world’s leading provider of information services and technology consulting to the organic semiconductor industry, has issued a second call for papers for the Organic Semiconductor Conference 2008 (OSC-08) which will take place in Frankfurt, Germany from 29 September – 1 October 2008.
Conference structure The main conference and exhibition will be held on 30 September and 1 October. The conference will offer an exciting mix of invited speakers and peer-reviewed papers. This year for the first time there will also be an Exhibitor Forum in which exhibiting companies are free to make product-related presentations. Confirmed invited speakers from industry include Acreo, Add-Vision, AIST, Aixtron, Bardsley Consulting, BASF, Cambrios, Cambridge Display Technology, cintelliq, DisplayBank, DuPont Research, DuPont Teijin Film, Evonik Degussa, Fluxim, Fraunhofer ISE, Fraunhofer IZM, FUJIFILM Dimatix, GIST, Holst Centre/TNO, IMEC, Imperial College London, ITRI, Kodak, Konarka, Liquavista, MicroEmissive Display, Merck, Mitsubishi Chemical, Nanoident, Nanomarkets, Nantero, Nokia, Novaled, OLED-T, Olla Project, Plastic Logic, Polymer Vision, printed systems, RO Consulting, Siemens, Solarmer Energy, Sumation, Thin Film Electronics, Thorn Lighting, UK Display and Lighting, Unidym, Universal Display Corp, University of Tokyo, Vitex Systems Next steps
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Wednesday, May 7, 2008
Organic Semiconductor Conference 2008 (OSC-08)
Monday, May 5, 2008
Exclusive Webcast from Analog Devices and EDN
| Please register today for this exclusive Webcast
A Stress-free Method for Selecting High-speed Amplifiers Date: Wednesday, May 7, 2008 How hard can it be to select the correct op amp for your design? With hundreds of variations of op amps available, each with a unique and sometimes vague set of specifications, the task can be daunting. In this online seminar, our amplifier expert will outline how to derive an application’s essential design considerations, and present a proven process and tools for selecting and verifying the optimum op amp to meet system requirements. Presenter
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Thursday, April 17, 2008
213th ECS Meeting - Tomorrow is the Last Day to Register
Tomorrow is the Last Day to Register for the
213th ECS Meeting
Phoenix, Arizona | May 18-22, 2008
Hyatt Regency Phoenix Hotel
For more information and to register, please visit our website: http://www.electrochem.org/.
Please note these important deadlines for the Phoenix Meeting:
1. Meeting and Short Course Registration Deadline: April 18, 2008 to qualify for the advance registration discount.
Register online: https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs.
Or fax or mail a hardcopy of your meeting registration forms with payment to ECS, 65 South Main St., Pennington, NJ 08534, USA, Fax: 1.609.737.2743, no later than April 18, 2008. Download the meeting registration brochure at: http://www.electrochem.org/meetings/biannual/213/phoenix_reg_bro.pdf.
Short Courses:
We are offering FOUR Short Courses in Phoenix on Sunday, May 18, from 0900h to 1630h. Current course list includes:• Advanced Impedance Spectroscopy
• Electrical Characterization and Characteristics of MOS Devices with Ultrathin High-k Gate Dielectrics
• Electrochemical Biosensors Based on Nanomaterials
• MEMS Reliability and Packaging
2. Hotel Reservation Deadline: April 18, 2008, or until sold out, whichever comes first.
For additional information and to reserve your room at the Headquarters Hotel:
http://phoenix.hyatt.com/groupbooking/phxrptels2008
Meeting Scheduler
The Personal Meeting Scheduler, sponsored by the ECS Battery Division, will allow you to browse through meeting programs, view abstracts, committee and other events and create printable schedules for upcoming ECS meetings. It is convenient and easy to use. For additional information and to use this feature, we invite you to create your user account and schedule for the Phoenix Meeting! Please follow this link to the Meeting Scheduler page: http://www.electrochem.org/meetings/scheduler/
First ECS Student Mixer
Arizona Diamondbacks/Detroit Tigers baseball game and reception
Sunday, May 18th at 11:30 AM, Tickets are free to the first 200 student registrants who RSVP to amir.zaman@electrochem.org.
Batteries, Fuel Cells, and Energy Conversion • Biomedical Applications and Organic Electrochemistry • Corrosion, Passivation, and Anodic Films • Dielectric and Semiconductor Materials, Devices, and Processing • Electrochemical/Chemical Deposition and Etching • Electrochemical Synthesis and Engineering • Fullerenes, Nanotubes, and Carbon Nanostructures • Nanotechnology, Nanomaterials, and Nanoscience • Physical and Analytical Electrochemistry • Sensors and Displays: Principles, Materials, and Processing
Tuesday, April 15, 2008
CDNLive! EMEA 2008 Invitation
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Thursday, April 10, 2008
Real-Time Analysis Techniques and Measurements for Radio Communications
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| Please register today for this exclusive Webcast
Benefits of Real-Time Analysis Techniques and Measurements Date: Tuesday, April 15, 2008 In the days of analog communications, everything was real-time. Broadcast communications and analog radios provided real-time sensory analysis on the quality of the signal being received. Real-time analysis has undergone rapid transformation in the advent of modern digital radio development. As the processing power of the computer world blends into the world of RF, the resulting Digital RF technologies require new real-time tools for development and analysis. Whether analyzing the propagation of MIMO radio signals, amplifying the latest WiMax or LTE amplifiers, or debugging Software Defined Radios, real-time analysis techniques and measurements enable the rapid development of Radio Communications systems.
Moderator Cheryl Ajluni, Industry Expert
Speaker |
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Tuesday, April 1, 2008
Last Call for Papers - ICMIT2008
Last Call for Papers - ICMIT2008
Our Technology Management Council Chapter in Singapore,
in cooperation with the Council and the IEEE Singapore
Section will be hosting an engineering management conference
September 21 to 24 2008 in Bangkok, Thailand.
Please see the information below and at www.ICMIT2008.org to
participate as an author or attendee for this conference.
Thank you.
- Prof. Charles Rubenstein, PhD, CEng <c.rubenstein@ieee.org>
Vice President Conferences
IEEE Technology Management Council
----- CALL FOR PAPERS (http://www.ICMIT2008.org) -----
The 4th IEEE International Conference on
Management of Innovation & Technology (ICMIT2008)
September 21 to 24 2008 - Bangkok, Thailand
www.icmit2008.org
ABOUT ICMIT
ICMIT2008 is the 4th International Conference on Management of
Innovation and Technology, first initiated by the IEEE Engineering
Management Society Singapore Chapter in 2000. ICMIT2008 intends to bring
together scholars, industrialists, and entrepreneurs interested in
improving their research and development, and business applications in
innovation and technology management across a global network of diverse
platforms. This conference is co-sponsored by IEEE Singapore Section and
IEEE Technology Management Council.
ICMIT 2008 invites papers on but not limited to the following topics:
Technology Management
Innovation Policy and Management
Process Innovation
Managing IT and E-Commerce
Knowledge Management
Project Management
Supply Chain Management
Sustainable Development
Global Production Network
Technology Intelligence and Planning
New Product Development
Entrepreneurship
Human Resource Management
Intellectual Property Right and Patent
R&D Management
Risk Management
Six Sigma and Quality Management
Service Science and Innovation
Authors are requested to submit full papers to the
ICMIT 2008 conference via the conference website.
The full paper should be no longer than 6 pages,
including title of the paper, keywords, name and
affiliation of the authors. All submissions will
be peer-reviewed for technical merit and content.
Accepted papers will be published in the conference
proceedings which will appear in IEEEXplore database
and indexed by Engineering Index (EI).
For more information, please visit http://www.icmit2008.org
(Tentative dates)
Deadline for submission of papers: 1 APRIL, 2008
Notifications of acceptance: 1 JUNE, 2008
Deadline for submission of final manuscript: 1 JULY, 2008
About Bangkok
Affectionately known as "The Land of Smiles", the
Kingdom of Thailand is one of the most fascinating
countries in Asia. This reflects on charm and friendly
attitude of Thai people. Over the last few decades,
Thailand's capital city, Bangkok, has changed into a
modern, exciting and sophisticated city. It offers to
visitors not only the cosmopolitan amenities they would
expect from other big cities, but also a unique
treasure trove of cultural attractions.
Bangkok offers visitors the opportunity to experience
fascinating glimpse of Thailand's gentle culture amidst
a great and dynamic metropolis. For visitors, Bangkok
has a feast of attractions to offer. The city is dotted
with glittering Buddhist temples of great beauty and
fascination, magnificent palaces, classical dance
extravaganzas, numerous shopping centres and traditional
ways of life, especially along the timeless river, the
Chao Phraya River, winding through the city.
SPONSORS
IEEE Engineering Management Society - Singapore Chapter
IEEE Technology Management Council
IEEE Singapore Section
CO-ORGANISER and OTHER SUPPORTING ORGANIZATIONS
Thammasat University
National University of Singapore
CONFERENCE MANAGER
Meeting Matters International
25 Hindoo Rd
Singapore 209116
Tel: (65) 6341 7229
Fax: (65) 6341 7269
Enquiries & Assistance
Email: info@icmit2008.org
Tuesday, March 18, 2008
CDVE2008 full paper deadline April 1 ...Mallorca, Sept. 2008
CDVE2008 call for papers, call for reviewers, call for sponsors, call
for exhibitors: http://www.cdve.org.
The 5th International Conference on Cooperative Design, Visualization
and Engineering (CDVE2008)
September 21-25, 2008, Mallorca, Spain
The conference proceedings will be published again by Springer Verlag
in its LNCS (Lecture Notes in Computer
Science). The accepted papers will be indexed by ISI Proceedings list
which is part of their Web of Knowledge,
EI, ACM Portal, DBLP, ZBlMath/CompuServe, IO-Port, Scopus, INSPEC, etc.
You are welcome to send this call for papers to the mailing lists you
belong to and any people working in the area that may be interested in
publishing their results in a high level publication. You can add a
link in your own page or your organization' s web page to the
conference website.
Deadlines and important dates:
Full Paper submission April 1, 2008
Notification of acceptance May 15, 2008
Final camera ready paper due June 15, 2008
Registration for accepted paper authors: June 30, 2008
Early registration July 31, 2008
Sept 21-25 2008: CDVE2008 conference in Mallorca, Spain
We expect your response to all these calls. You can contact
cdve2008@uib.es for any information you need or to send your suggestions.
Will be our pleasure to see you all in CDVE2008 in Mallorca, Spain!
Segundo llamado - JAR08
Hola compañeros,
Por si interesa.
Cordiales saludos.
Gerardo
*Segundo llamado a Presentación de Trabajos - JAR08*
/Estimados colegas, estudiantes y amigos: /
Tenemos el agrado de dirigirnos a Uds. para invitarlos a participar de
las*/ /**/V Jornadas Argentinas de Robótica (JAR08)/**/,/* que se
realizará entre los días 12 y 14 de noviembre de 2008 en la Universidad
Nacional del Sur, Bahía Blanca, Argentina.
El propósito de las JAR08 es promover la investigación y el desarrollo
en robótica en la Argentina como así también la integración de la
comunidad científica del país y la región interesada en dicha
especialidad. Desde el año 2000 se han organizado cuatro jornadas que
tuvieron lugar en dos ciudades importantes como son San Juan y Córdoba.
En la última oportunidad, se presentaron 30 trabajos y asistieron más de
120 colegas provenientes en su mayoría de Argentina, Brasil y Chile.
Las jornadas se desarrollan principalmente a través de presentaciones
orales de los trabajos aceptados. En esta oportunidad se prevé la
realización de una sesión especial de Inteligencia Computacional en
Robótica y la organización de sesiones plenarias a cargo de destacados
profesionales en las áreas de interés de la reunión.
*Temas de Interés (no excluyentes):*
- Actuadores
- Cinemática y dinámica
- Control de movimiento y fuerza
- Humanoides
- Inteligencia artificial
- Interacción hombre-robot
- Interfaces
- Localización y construcción de mapas
- Manipuladores robóticos y manipulación
- Modelado, identificación y control
- Planificación de movimientos
- Robótica móvil y de campo
- Sensores: modelado, fusión de datos, percepción
- Simulación
- Sistemas de eventos discretos
- Sistemas de manufactura
- Sistemas de tiempo real
- Sistemas multirobot
- Teleoperación
- Desarrollos y aplicaciones relacionadas
*_ _*
*Fechas importantes:*
Recepción de Trabajos: *15/03/2008* al *15/04/2008.*
Notificación de aceptación: *01/08/2008.*
Recepción de Trabajos Definitivos: *01/09/2008.*
*_ _*
* *
*Envío de Trabajos*
En esta edición de las Jornadas se contemplarán dos categorías de trabajos:
_Trabajos regulares_: describen resultados originales que no han sido
publicados aún y que se enmarcan dentro de las temáticas propuestas por
las Jornadas.
Deberán presentarse en un archivo PDF y no deberán exceder las 6
páginas. El envío será electrónico a través de la página
http://www.easychair.org/conferences/?conf=jar08 provista por el sistema
EasyChair <http://www.easychair.org/conferences/?conf=ab2008comm>.
Los mismos serán sujetos a proceso de revisión y la versión final de los
trabajos aceptados será publicada en el CD de las Jornadas.
_Comunicaciones_: describen iniciativas, proyectos, ideas, aplicaciones,
investigaciones, etc. que por encontrarse en etapas de desarrollo y/o
evaluación no resultan suficientes para formalizarse en un "trabajo
regular" pero que su divulgación y discusión puede despertar el interés
de los asistentes.
Deberá presentarse un resumen de no más de 2 páginas en formato PDF. Los
mismos se enviarán directamente a la dirección de email de las JAR'08
(jar08@uns.edu.ar <mailto:jar08@uns.edu.ar>) para su consideración. Las
comunicaciones se expondrán en forma oral bajo las mismas condiciones
que los trabajos regulares. El resumen será publicado en el CD de las
Jornadas en la modalidad "comunicación sin referato".
* *
Tanto los trabajos regulares como los resúmenes deberán prepararse
siguiendo las instrucciones que se detallan en la página web de las
jornadas http://lcr.uns.edu.ar/jar08. Dicha información pueden también
solicitarse por e-mail o correo postal a la comisión organizadora.
*Idioma*:
El idioma oficial de las Jornadas será el *español*, aunque también se
admitirán trabajos en *inglés*.
*/ /*
Los saluda muy cordialmente,
Comité Organizador
V Jornadas Argentinas de Robótica
Departamento de Ingeniería Eléctrica y de Computadoras
Universidad Nacional del Sur
Avda Alem 1253, B8000CPB Bahía Blanca, Argentina
Email: jar08@uns.edu.ar <mailto:jar08@uns.edu.ar>
IEEE R8: Professional Training Course - Advanced Industrial Control (IAS & CSS of Spain)
Join us for our first event and featured professional training event
of 2008! As with our SAICA 2007 seminar, we will be hosting IEEE members from
across Region 8, so in addition to learning about advanced industrial control
methodologies, you can expect to network with a truly international group of
course participants from across the EMEA area. The course will be taught in
English and we are proud to also host key note speaker Senior Member Dr. Pilar
Molina Gaudo, professor at the University of Zaragoza. Dr. Molina Gaudo will
be the featured speaker at the dinner to be held on the evening of 26th.
Key Information: 26-27 March, 2008/Madrid/Discounted IEEE Pricing
Included: 2-Day Intensive Training Course, Software Evaluation Pack,
Breakfasts, Lunches and Featured Speaker Dinner on 26 March.
Audience: Engineering and Technical Professionals Involved in Industrial
Control and Optimization, Professors and Graduate Students of Industrial
Engineering.
Key Links
Learn more about the event on the R8 Web Page:
http://www.ewh.ieee.org/reg/8/cms/
Check Out the Chapter Web Site and Sign-Up for the Course:
Learn More About Our Last International Event:
1) The Official SAICA 2007 Debrief
http://www.ieee-ias-css.es/modules.php?name=Content&pa=showpage&pid=35
2) Coverage in The Institute
http://www.theinstitute.ieee.org/portal/site/tionline/menuitem.130a3558587d56e8fb2275875bac26c8/index.jsp?&pName=institute_level1_article&TheCat=2201&article=tionline/legacy/inst2008/feb08/featureSAICAconf.xml&
Dr. Molina Gaudo's profile can be viewed in the "Meet Our Members" profile box
http://www.ieee.org/web/membership/home/index.html
Thursday, March 13, 2008
Exclusive Webcast from Ansoft and EDN
| You are receiving this email as a subscriber to an EDN enewsletter. For customer support or to stop receiving future promotional offers from EDN, please scroll to the bottom for instructions. |
| Please register today for this exclusive Webcast New Technology for Rapid and Accurate Simulation of Multi-Gigabit Serial Channels Thursday, March 20, 2008 Modern electronic products use multi-Gigabit serial links to move large quantities of digital data across today’s telecommunication, high-definition video, gaming, and data storage systems. Engineers designing links such as 10-Gigabit Ethernet, 8.5 Gb/s Fibre Channel, InfiniBand, and PCI Express 3.0 demand accurate channel simulation and modeling to maintain stringent signal quality, jitter and bit error ratio (BER) performance. When verifying the low BER’s required by the multi-Gigabit protocols, traditional transient simulation techniques are at odds with the design cycle compression being driven by today’s tight time-to-market windows. There simply isn’t enough time to push the number of bits needed with robust sampling to derive meaningful BER results. Statistical methods are emerging that allow engineers to rapidly predict channel level performance with eye diagram plots and BER curves. This one-hour Web seminar introduces two new simulation technologies, a fast transient and a statistical tool, that are now included in Ansoft’s circuit simulation engine, Nexxim. The fast transient tool uses long, user defined bit patterns to produce an eye diagram. This analysis allows engineers to create controlled stress tests and to identify specific bit sequences that cause bit errors. The statistical tool produces both eye diagram plots and BER curves for complete high-speed channels in minutes. Because these technologies link to full-wave electromagnetic field solvers and a high capacity circuit simulation engine, accuracy is not sacrificed for the improved simulation speed. After a brief introduction to the tools and the presentation of comparative performance data, two channel examples will be demonstrated. The first channel will serve to highlight the general capabilities of the simulation technologies. The second will demonstrate the use of the tool in the pre-layout design of a serialized/de-serialized (SerDes) channel with equalization developed for IBM’s next generation BladeServer backplane. Presenter Eldon Staggs, Senior Applications Engineer, Ansoft Corporation Eldon specializes in high-frequency and high-speed circuit and system design. He works with Ansoft’s top tier customers on their serial interconnect designs, RF microwave circuits, and wireless communication systems. He has over 15 years design experience and is an expert in system, RF, analog, and digital engineering for electronic warfare and electronic intelligence systems. He earned his BSEE from the University of New Mexico in Albuquerque, NM, and his MSEE from the University of California at San Diego. |
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Tuesday, March 11, 2008
NOMS 2008: Register Today & Save
Last Call for Papers/Abstracts
Announcement
-------------------------------------------------------
Last Call for Papers/Abstracts and Invited Sessions Proposals for CITSA 2008, (Orlando, Florida, USA. June 29th- July 2nd, 2008) http://www.infocybereng.org/citsa2008
Deadlines:
Papers/Abstracts Submissions and Invited Sessions Proposal: April 2nd, 2008
Authors Notification: May 3rd, 2008
Camera-ready, full papers: May 22nd, 2008
-------------------------------------------------------
All Submitted papers will be reviewed by a double-blind (at least three reviewers), non-blind, and participative peer review. These three kinds of review will support the selection process of those that will be accepted for their presentation at the conference, as well as those to be selected for their publication in JSCI Journal.
Authors of accepted papers who registered in the conference can have access to the evaluations and possible feedback provided by the reviewers who recommended the acceptance of their papers/abstracts, so they can accordingly improve the final version of their papers. Non-registered authors may not have access to the reviews of their respective submissions.
The registration fee of effective invited session organizers will be waived and they will receive at the registration desk, for free, 1) a package of 4 DVDs and one CD containing the 6-hour tutorial "Fundamentals and History of Cybernetics: Development of the Theory of Complex Adaptive Systems" and 2) a second 4-DVDs/1-CD package 6-hours tutorial titled "Cybernetic Management". The market price of each of these packages is US $ 295. Twelve more benefits for invited session organizers are listed at CITSA 2008 web page.
For submissions or Invited Sessions Proposals, please go to the web site: http://www.infocybereng.org/citsa2008/organizer.asp
Authors of the best 10%-20% of the papers presented at the conference will be invited to adapt their papers for their publication in the Journal of Systemics, Cybernetics and Informatics.
Each session to be included in the conference program will have corresponding electronic pre-conference and post-conference sessions for 15 days each. In the electronic pre-conference sessions authors will have access to the papers to be presented at their session and to an associated electronic forum, so they can be better prepared for their conference face-to-face session. Similarly, electronic post-conference sessions will complement and support a follow-up of the respective conference sessions, via an electronic forum and the possibility of evaluating papers presented at the associated session. These evaluations will also support the selection process for the papers to be published in JSCI journal.
Best regards,
CITSA 2008 Secretariat
If you wish to be removed from this mailing list, please send an email to citsa.remove@mail.infocybereng.org with REMOVE MLCITSA in the subject line. Address: Torre Profesional La California, Av. Francisco de Miranda, Caracas, Venezuela.
Thursday, March 6, 2008
[isvlsi] ISVLSI in Montpellier, France, April 7-9 2008 - Call for participation
Please accept our apologies if you receive multiple copies of this call
IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI
April 7-9, 2008
Montpellier, France
http://www.lirmm.fr/isvlsi2008/
******************************************************************
Final Programme available!!
http://www.lirmm.fr/isvlsi2008/programme.htm
******************************************************************
Registration
http://www.lirmm.fr/isvlsi2008/registration/registration.php
Early Registration Deadline: March 15th, 2008
******************************************************************
__________________________________________________________________________
This Symposium explores emerging trends, novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems, and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies.
Future design methodologies will also be one of the key topics at the workshop, as well as new CAD tools to support them. For almost two decades, the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI.
It brings together leading scientists and researchers from academia and industry, and has established a reputation in inviting well-known international scientists as invited speakers. The 2008 edition will continue to strive to achieve the high standards that participants have come to expect of this Symposium.
__________________________________________________________________________
General Chair
Lionel Torres
LIRMM, Montpellier, France
University of Montpellier/CNRS
General Co-Chair
Amar Mukherjee
University of Central Florida, USA
Program Chair
Ian OConnor
Ecole Centrale de Lyon
INL, Lyon, France
Program Co-Chair
Asim Smailagic
Carnegie Mellon University, USA
Publicity Chair (Europe)
Reiner Hartenstein
TU Kaiserslautern, Germany
Publicity Chair (USA)
Don Bouldin
University of Tennessee, USA
Local Chair
Pascal Benoit
LIRMM, Montpellier, France
University of Montpellier/CNRS
Diamond 2008: Call for Papers Deadline - 7 March 2008
| Please open the online version of this message if the HTML is not correctly displayed. |
| DIAMOND 2008 CALL FOR PAPERS DEADLINE - FRIDAY 7 MARCH 2008 Submit abstracts now for Diamond 2008 Please remember that the deadline for submission of abstracts at the 19th European Conference on Diamond, Diamond-like Materials, Carbon Nanotubes and Nitrides is Friday 7 March 2008.
INVITED SPEAKERS The following experts have agreed to speak at the conference: James Butler, Naval Research Labs, USA- Growth mechanisms of diamond revisited John Foord, Oxford University, UK - Electrochemistry of diamond surfaces Masataka Hasegawa, AIST, Japan - Low temperature growth of nano-diamond Russell Hemley, Carnegie Institute, USA - High growth rate diamond Dean Ho, North Western University, USA - Drug delivery by nanodiamond Anke Krueger, University of Kiel, Germany - Functionalisation of nanodiamond surfaces Christoph Nebel, AIST, Japan - Bio-sensors from diamond Eiji Osawa, Shinshu University, Japan - Recent progress in nanodiamond Atsuhito Sawabe, Aoyama Gakuin University, Japan - Progress in hetero-epitaxial growth of diamond Thomas Seyller, University of Erlangen, Germany - Production and electronic structure of graphene François Silva, University Paris 13, France - High quality homoepitaxial diamond growth Wenjun Zhang, City University of Hong Kong, China - Growth, nano-structuring and properties of cBN films Diamond 2008 is organised by Elsevier in association with Diamond & Related Materials. Data Protection Notice: This e-mail has been sent to rodrigo.picos@uib.es from Elsevier Ltd., The Boulevard, Langford Lane, Kidlington, Oxford OX5 1GB, registered in England with registered number 1982084, using Email Reaction's technology and platform. To ensure delivery to your inbox (not bulk or junk folders), please add conferences@mail.elsevier-alerts.com to your address book or your safe senders list. You are receiving this e-mail because you are an Author, Editor or Contributor of an Elsevier product in the belief that it will be of interest to you. If you do not wish to receive calls for papers for Elsevier Conferences, you can visit this page to Unsubscribe, enter your email address, and press the submit button and you will be unsubscribed. Elsevier respects your privacy and does not disclose, sell or rent your personal information to any non-affiliated third parties without your consent, except as may be stated in the Elsevier Privacy Policy. Please visit this page to see Email Reaction's Privacy Policy. For all enquiries, problems or suggestions regarding this service, please contact: em.white@elsevier.com. Copyright © 2008 Elsevier Ltd. all rights reserved. |
Tuesday, March 4, 2008
IEEE SENSORS 2008 in Italy - Submissions due 31 March
=================================================================
The IEEE SENSORS 2008 conference is scheduled to be held October 26 to October 29, 2008 in Lecce, Italy.
Abstracts are due 31 March 2008. The call-for-papers can be found at
www.ieee.org/sensors
The Abstract Submission website is open at
www.ieee-sensors2008.org
If you have a question that is not answered on the conference website, feel free to contact Katharine Cline, Conference Manager, at info@ieee-sensors2008.org or +1-619-232-9499.
=================================================================
IEEE SENSORS 2008 is sponsored by the IEEE Sensors Council.
For information, about other Sensors Council activities, especially
the IEEE Sensors Journal, please visit www.ieee.org/sensors
=================================================================
Wednesday, February 27, 2008
New Technical T&M Web Seminar: C-V Measurements and Materials Research
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Monday, February 25, 2008
ECS - 213th Meeting - Registration Open
REGISTRATION IS NOW OPEN!
213th ECS Meeting
May 18-22, 2008
Phoenix, AZ
For more information and to register, please visit our website: http://www.electrochem.org/.
Please note these important deadlines for the Phoenix Meeting:
1. Meeting and Short Course Registrations are due to ECS Headquarters no later than April 18, 2008 to qualify for the advance registration discount.
Register for the meeting using our online system that processes your Visa, MasterCard, or American Express credit card payment in real time:
https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs.
If you prefer, send or fax a hard copy of your meeting registration forms with payment to The Electrochemical Society, 65 South Main St., Pennington, NJ 08534, USA, Phone: 1.609.737.1902, Fax: 1.609.737.2743, E-mail: ecs@electrochem.org, no later than April 18, 2008. You can download the meeting registration brochure at:
http://www.electrochem.org/meetings/biannual/213/phoenix_reg_bro.pdf.
Please Note: All technical registrations include a copy of the meeting abstracts on CD-ROM only. Attendees who wish to have paper copies of abstracts should download them in advance of the meeting from the ECS website:
http://ecsmeet5.peerx-press.org/jsp/mas/reportSymposiumList.jsp.
2. Hotel reservations are due no later than April 18, 2008!
Located in the center of downtown – steps from the Phoenix Convention Center, Symphony Hall, and Herberger Theater – the Hyatt Regency Phoenix Hotel places you near spectacular sports, arts, culture, and attractions.
A block of rooms have been reserved for May 5-27, 2008. The special room rate will be available until April 18th or until the group block is sold-out, whichever comes first.
Special Room Rates:
$165 per night, per room for single/double occupancy
$215 per night, per room for triple occupancy
$240 per night, per room for quadruple occupancy
Please follow the link to make a hotel room reservation online: http://phoenix.hyatt.com/groupbooking/phxrptels2008
See you at the Hyatt Regency Phoenix in May!
Batteries, Fuel Cells, and Energy Conversion • Biomedical Applications and Organic Electrochemistry • Corrosion, Passivation, and Anodic Films • Dielectric and Semiconductor Materials, Devices, and Processing • Electrochemical/Chemical Deposition and Etching • Electrochemical Synthesis and Engineering • Fullerenes, Nanotubes, and Carbon Nanostructures • Nanotechnology, Nanomaterials, and Nanoscience • Physical and Analytical Electrochemistry • Sensors and Displays: Principles, Materials, and Processing
Tuesday, February 19, 2008
Design News: Volume 8, Issue 7
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 | February 18 2008  |
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Feature Story | ||||||||||||
 | There's a new face on ColdFire, and you'll start seeing it on print and online ads in your favorite publications. We've introduced a new microsite for our 15-year-old MCU, freescale.com/coldfire101, that is everything ColdFire, from architecture to training, in an exciting new look. It's fun and informative, and we're out to tell the world about it. |
Knowledge Bank
Educational materials such as presentations, webcasts and white papers
Wind River Seminar: Making Multicore Work
Interested in learning how to maximize your multicore development? Register today for the half-day seminar, Making Multicore Work. We're teaming up with Wind River to present this session across several major European cities. Wind River's multicore architectures and multiprocessing, and the newly announced Freescale MPC8572 PowerQUICC® III communications processor will be featured. Register today.
LTE: Next-gen mobile solutions for bandwidth-intense applications
Flip through the pages of any trade publication and you'll see something written about Long Term Evolution (LTE). Without a question, LTE is hot. And it was on everyone's mind at Mobile World Congress in Barcelona last week.
Engineered to provide high-speed, low-latency data to unlock high-bandwidth applications, LTE is a highly anticipated technology for tomorrow's mobile environment. In Barcelona, we demonstrated LTE feature capabilities, including uplink and downlink at high data rates with streaming HD video.
Most analysts have suggested LTE-enabled consumer devices are at least a year away, yet we're already achieving peak data rates of 96 Mbps downlink and 86 Mbps uplink for mobile devices — and plan to go higher as the standard matures.
Learn more about LTE at www.freescale.com/LTE, and read the press release about our LTE demos from Mobile World Congress.
eeTECHbrief webcast: Connectivity Solutions for Industrial Applications
Are you ready to shorten your 32-bit design time? Freescale's Connectivity Solutions for Industrial Applications eeTECHbrief webcast will help you get started. Gain an understanding of the benefits provided by a single-chip ColdFire® MCU and learn how CodeWarrior® for ColdFire v7.0 simplifies 32-bit designs. You'll also learn about:
Register at eeTECHbrief.com under "MPU/MCUs" events today. At the end of the webcast you'll receive a coupon code for 50 percent off a demo board.
Newsroom
Press releases from Freescale
Rich Beyer to join Freescale as chairman and CEO
Last week Rich Beyer was named chairman and CEO of Freescale. Beyer succeeds Michel Mayer, who will continue to serve as chairman of the board and CEO until the transition is effective in March. Beyer comes to Freescale from Intersil Corporation. Read more.
Also see: "Q&A with Freescale's New CEO" by Emily Thornton (BusinessWeek) "Freescale's new CEO optimistic" by Max Jarman (Arizona Republic)
Enhancements planned for 3G Mobile eXtreme Convergence reference design
Take Freescale's Mobile eXtreme Convergence (MXC) architecture and then combine it with S60 and Symbian OS™ — and you've got a powerful trio. The three companies created the first HSDPA mobile phone reference design using Freescale's MXC. That design has developed into a mature solution, addressing both upper-low-tier and mid-tier 3G market segments. Freescale continues to enhance the first 3G mobile phone reference design using MXC with S60 and Symbian OS. Design enhancements and cost reductions with the newly-introduced fully-integrated RFCMOS 90nm radio reference design is planned as part of another collaboration with S60 and Symbian. Read more.
Linux community now has integrated Linux BSP for mobile handset applications
The rumor is true. Support for the Linux® operating system on our cellular products is available. Freescale's Linux cellular platform is capable of supporting any Linux Application Framework, whether it's an industry standard or an OEM's proprietary solution. Read more.
Deep packet inspection available for IP-based telecom networks
With telecommunications infrastructure networks becoming more IP-based, network security solutions are even more critical. Together, with Qosmos, we're providing high-performance deep packet inspection solutions using Qosmos' Qoala software on Freescale's MPC8572E PowerQUICC® III processor. The same platform capability will be able to scale from today's dual core MPC8572E to Freescale's innovative multicore platform. Read more.
Partnership helps expand automotive presence in China
China is the second largest automotive market in the world, following only the United States. To create new opportunities in this rapidly growing market, we've formed an alliance with Comtech Group, Inc. We'll focus on using our advanced semiconductor technology in Comtech's customized module solutions, concentrating on its original equipment manufacturing (OEM) and original design manufacturing (ODM) customers in the Chinese automotive market. Read more.
MXC cellular platform supports Microsoft Windows Mobile
Now carriers have the opportunity to deliver desktop "familiarity" through handheld devices. Last week at Mobile World Congress, we announced the integration of the Microsoft Windows Mobile operating system with our Mobile eXtreme Convergence (MXC) cellular platforms. MXC's unique single core modem architecture enables smartphone capabilities at feature-phone prices. Read more.
Product Alerts
Updates about our products, technologies and services
Introducing the industry's most accurate Li-ion battery charger ICs
The industry's most accurate power management ICs that help you get the longest life from your lithium-ion (Li-ion) battery-powered applications have arrived.
Introducing the MC34671, MC34673 and MC34674. These single-input autonomous battery charger ICs offer output voltage accuracy of +/-0.4 percent over temperature and charging current accuracy of +/‑5 percent over temperature. And they can be factory customized to create hundreds of configurations. Read more.
Events
Programs in which Freescale is a host or participant
Add Freescale to your embedded world 2008 agenda
Add us to your embedded world 2008 plans. Whether you're designing a consumer appliance, an industrial solution, or just about any kind of embedded application, you can learn from Freescale engineers and experts who will be on site to share their expertise. We're showcasing a wide range of industry-leading solutions and we're presenting several important white paper sessions to help you with your next innovative design. Get all the details.
24-26 February
Nuremburg, Germany
Hall 9, Stand 335
My Technical Subscriptions
Current documentation and tool updates
Analog and Mixed Signal
Network Transceivers
LIN, ISO9141, J1850 Physical Interfaces
Documentation : Data Sheets
MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K
MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K
MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K
System Basis Chip
Documentation : Data Sheets
MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K
MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K
MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K
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