Circuit Simulation-Driven Analog/RF System-in-Package Webinar Series
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Overview
Today's wireless devices manufactures are constantly challenged to pack more functionality into less space in ever-shrinking market windows. To address this demand, analog/RF system-in-package (SiP) modules are becoming one of the fastest growing integration fabrics in the wireless silicon market. However, when designing these complex RF SiP modules, designers are facing challenges that conventional methodologies and technologies just cannot overcome.
In this webinar series, Cadence will take you through these common challenges — presenting a new methodology and integrated technologies that address your key pain points. The webinars will include detailed demonstrations using the latest Cadence SiP RF methodology and technologies that seamlessly integrate with the Cadence® Virtuoso® custom design platform. By attending these webinars, you will learn how driving an RF SiP module implementation from a single top-level schematic (that includes RF/analog die, embedded RF discretes, post-layout parasitic extraction, constraint-driven interconnect, and full SiP tapeout manufacturing preparation) enables full pre- and post-route circuit simulation of the entire SiP.
Archived webinar: Introduction to Circuit Simulation-Driven RF/Analog System-in-Package Design
Topic: | Interfacing With the IC Package Design Team Using Virtuoso and SiP RF Architect |
Date: | 10/25/07 |
Time: | 9:00 AM Pacific |
What you will learn:
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Topic: | Circuit Simulation of Analog/RF ICs with IC Package Interconnect Using Virtuoso ADE and SiP RF |
Date: | 11/15/07 |
Time: | 9:00 AM Pacific |
What you will learn:
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Topic: | Designing Off-Chip IC Package/SiP-Level Passive Structures Using Virtuoso and SiP RF Technology |
Date: | 12/13/07 |
Time: | 9:00 AM Pacific |
What you will learn:
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Topic: | Advanced Techniques for IC Package/SiP Parasitic Extraction/Modeling and Backannotation for Circuit Simulation Using Virtuoso ADE and SiP RF |
Date: | 1/24/08 |
Time: | 9:00 AM Pacific |
What you will learn:
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Topic: | Top-Down Design and Circuit Simulation of Analog/RF Systems-in-Package Using Virtuoso and SiP RF Solutions |
Date: | 4/8/08 |
Time: | 9:00 AM Pacific |
What you will learn:
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- Cadence Virtuoso custom design platform
- Cadence SiP RF technology
- Analog/RF/Wireless chip design team members
- Advanced IC package designers
- Wireless product/system designers and architects
- Existing Virtuoso custom design platform users
Questions about this event?
Send email to events@cadence.com
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