IEEE 2008 International Interconnect Technology Conference
June 2-4, 2008
Hyatt Regency at San Francisco Airport, Burlingame, CA
SUBMISSION DATE: FEBRUARY 1, 2008
The 11th IITC Conference, the premier conference dedicated to advanced
interconnect technology, is soliciting paper submissions for the 2008
conference. The IITC provides a forum for professionals and researchers in
semiconductor processing, advanced materials, equipment development and
interconnect systems to present and discuss exciting new science and technology.
Now in its second decade, the conference will include new subjects of interest.
Contributions from universities, national laboratories, IDMs and equipment and
materials suppliers are encouraged.
Contributed papers addressing all aspects of interconnect technology (Materials
and Unit Processes; Process Integration; Process Modeling; Manufacturing
Issues; Reliability; 3D Processes and Integration; Interconnect Systems; System
in a Package; System-on-a-Chip; Novel Materials and Concepts) will be rigorously
reviewed and papers will be accepted for either oral or poster presentation.
Papers will be published in the conference digest and CD-ROM. The paper
submission deadline is February 1, 2008.
Complete details, including electronic paper submission and paper preparation
instructions, are available at: http://www.ieee.org/conference/iitc or contact
the conference at iitc@his.com
The IITC Conference is sponsored by the IEEE Electron Devices Society.
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