[Fwd: Innovative Dynamic Studies of Materials at the Nanoscale - General Announcement & Call for Abstracts]

Dear Colleague,

Abstract submission is open for “Innovative Dynamic Studies of Materials at the Nanoscale”.

 

Abstracts for the “Innovative Dynamic Studies of Materials at the Nanoscale” conference, to be held in Gyeong-ju, Korea from June 29 – July 4, 2008 will be accepted through:

 

Invited and Contributed Oral Presentations: December 31, 2007

 

Contributed Poster Abstracts: March 31, 2008

 

For complete conference details, and to submit an abstract, please visit the conference web site: www.engconfintl.org/8ai.html

Thank you for your interest in our program.

 

Engineering Conferences International

info@eci.poly.edu

IDEAs DAY « Les matières des designs » - 18 décembre 2007 - MINATEC, Grenoble

a le plaisir de vous annoncer son prochain IDEAs Day Le 18 décembre 2007 -  9h30 / 18h30 A la Maison des Micro et Nano Technologies - MINATEC - Grenoble Conférence internationale « Les matières des designs » Intervenants : Bernard STIEGLER, Directeur de l'IRI Centre Pompidou  -   Fédérico CASALEGNO, Directeur du Mobile Experience Laboratory et directeur associé du Design Laboratory du MIT - Adam GREENFIELD, Spécialiste du design numérique, écrivain et consultant, enseignant à l'Université de New York - Alain CADIX, Directeur de l'ENSCI -    Vincent CREANCE, Designer, directeur de l'agence Mbd - Frédéric BEUVRY, Directeur Corporate design, Groupe Seb. En partenariat avec :   Télécharger le programme et le plan d'accès   Inscription auprès de Stéphanie CUMAN (stephanie.cuman@cea.fr) avant le 10 décembre 2007 Frais d'inscriptions : - Partenaires de MINATEC IDEAs Laboratory®  : Gratuit - Extérieurs : 40 € (repas compris) - Enseignants, chercheurs et étudiants : 15 € Règlement par chèque à l'ordre de l'Agent comptable de l'Université Stendhal

213th ECS Meeting - Abstract Submission Deadline 3 Weeks Out

ABSTRACT SUBMISSION | 213^th ECS Meeting

Phoenix, AZ

May 18-23, 2008

Abstract Deadline: December 17, 2007

Only 3 weeks away!

Deadlines
Abstract Submission
Abstract Submission Now Open! | Please be aware that the abstract submission deadline is approaching. Abstracts are due NO LATER than December 17, 2007. Please carefully check each symposium listing for any alternative abstract submission deadlines. To submit an abstract, please follow the link to the online abstract submission system – http://ecsmeet5.peerx-press.org/cgi-bin/main.plex

Registration
Meeting registration will open in February. The deadline for Advance Registration is April 18, 2008.

Hotel
Hyatt Regency Phoenix is the Meeting hotel. Reservations are due by April 18, 2008 and can be made from the ECS website.

ECS Transactions
Full papers presented at ECS meetings will be published in the online publication, ECS Transactions (ECST). Visit the ECS website for more details.

Travel Grants
Travel Grants are available for student attendees. Requests are due by December 17, 2007.

Visit the ECS website for meeting details.

www.electrochem.org

Batteries, Fuel Cells, and Energy Conversion • Biomedical Applications and Organic Electrochemistry • Corrosion, Passivation, and Anodic Films • Dielectric and Semiconductor Materials, Devices, and Processing • Electrochemical/Chemical Deposition and Etching • Electrochemical Synthesis and Engineering • Fullerenes, Nanotubes, and Carbon Nanostructures • Nanotechnology, Nanomaterials, and Nanoscience • Physical and Analytical Electrochemistry • Sensors and Displays: Principles, Materials, and Processing

--  ************************* Rodrigo Picos Prof. Colaborador Dept. Física Univ. Illes Balears Tel. +34 971 172505 Fax. +34 971 172486 http://sedemos.blogspot.com/ Ed. Mateu Orfila Campus UIB 07122 - Baleares SPAIN *************************

ISPLC 2008 Call For Papers Deadline Extended to December 2, 2007

 

The 2008 IEEE International Symposium on Power-Line Communications and Its Applications (ISPLC 2008) will be held at the Ramada Plaza Jeju Hotel in Jeju Island, Korea during April 2-4, 2008. This is the 12th Annual ISPLC Meeting, now fully organized and operated under the auspices of the IEEE Communications Society.

The symposium is centered on the general problem of communication over power lines. It focuses on the latest technological advances in power line communications, as well as on current and future applications of power line communication systems. The goal of the symposium is to bring together academia, industry, and standardization organizations to stimulate research, development, and commercialization of all aspects of power line communication technology. The ISPLC 2008 is sponsored by the IEEE Communications Society, technically co-sponsored by the IEEE Power Engineering Society, and supported by Korea Information and Communications Society (KICS) and Korean Institute of Electrical Engineers (KIEE).

Prospective authors are invited to submit original contributions on all aspects of power line communications, including but not limited to:

* Channel Measurements and Modeling
* Standards and Regulations
* Electromagnetic Compatibility, Co-existence and Interoperability
* Modulation and Coding Techniques
* Security
* Utility Applications, AMR, and Services
* Multimedia Transmission and Signal Processing
* Multiple-Access Techniques
* Modem and LSI Design
* Network and Service Management
* System Architectures
* Experimental Systems and Field Trials
* PLC Command and Control

Full Paper Submission: extended December 2, 2007
Notification of Acceptance: January 15, 2008
Presenting Author Registration: January 31, 2008

For more information, please visit http://www.isplc2008.org/

IEEE Young Professional Online Seminar: 21st Century Engineer

-------- Mensaje original --------

Asunto:	IEEE Young Professional Online Seminar: 21st Century Engineer
Fecha:	Wed, 21 Nov 2007 15:00:00 -0500
De:	IEEE GOLD <gold@ieee.org>
Responder a:	gold@ieee.org
Para:	rodrigo.picos@uib.es
Referencias:	<A11956715544897142385.rodrigo.picos@uib.es>

IEEE GOLD is sponsoring their last online seminar for 2007, "The 21st Century Engineer", by Adrian Pais scheduled for Tuesday, 4 December 2007 at 9:00am Eastern (New York) or 14:00 GMT for one hour.   Seminar Abstract: The last decade has seen a dramatic change in the economic and social landscape of society. At the forefront of this change has been the engineering profession, which has consistently produced groundbreaking innovations. Today, engineers are faced with ever-changing business models, shorter product life cycles, cutthroat competition and conflicting values. This talk will discuss the changing nature of the engineering profession, and the challenges and opportunities that this presents. Six essential values that an engineer should possess in the 21st century will be identified and discussed: holism, leadership, continuous learning, creativity, entrepreneurship and social responsibility.   Biography: Adrian Pais (PhD) is a telecommunications specialist presently working in a consulting role for the Netherlands Organization for Scientific Research (TNO). He serves as a representative for young engineers on the IEEE Publication Services and Products Board. His paper on "The 21st century engineer" won the IET (The Institution of Engineering and Technology) Write Around the World competition, and he has presented it in several countries including New Zealand, Zambia, Netherlands, United Kingdom, Germany and Hong Kong.   To register for the online seminar, go to http://lra100.livemeeting.com/LRSRegistration/EC/ieee/460474922.aspx . For more information on the seminar, go to http://www.ieee.org/web/membership/gold/events/APaisDec07.html.  Registration for this seminar will close on Saturday, 1 December 2007.  ================================================================================ You have received this mailing because you are a member of IEEE and/or one of the IEEE Technical Societies.   To unsubscribe, please go to http://ewh.ieee.org/enotice/options.php?SN=Picos Gaya&LN=GOLD and be certain to include your IEEE member number.   If you need assistance with your subscription, please contact k.n.luu@ieee.org ================================================================================ 

ISVLSI in Montpellier, France, April 7-9 2008 - Call for Paper

¤---------------------------------------------------------------¤
IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI
¤---------------------------------------------------------------¤
April 7-9, 2008, Montpellier, France

http://www.lirmm.fr/isvlsi2008/

¤---------------------------------------------------------------¤

¤---------------------------------------------------------------¤
3 weeks remaining to submit your article!!!

-> http://www.lirmm.fr/isvlsi2008/MyReview/

ISVLSI 2008 - Paper Submission Deadline: December 5th, 2007
¤---------------------------------------------------------------¤


This Symposium explores emerging trends, novel ideas and concepts in the
area of VLSI. The Symposium covers a range of topics: from VLSI circuits,
systems, and design methods to system level design and system-on-chip
issues, to bringing VLSI experience to new areas and technologies.

Future design methodologies will also be one of the key topics at the
workshop, as well as new CAD tools to support them. For almost two decades,
the Symposium has been a unique forum promoting multidisciplinary research
and new visionary approaches in the area of VLSI.

It brings together leading scientists and researchers from academia and
industry, and has established a reputation in inviting well-known
international scientists as invited speakers. The 2008 edition will continue
to strive to achieve the high standards that participants have come to
expect of this Symposium.

__________________________________________________________________________

The symposium proceedings are published by IEEE Computer Society Press.
__________________________________________________________________________

We cordially invite you to participate and submit your contribution to
ISVLSI2008, which includes (but is not limited to) the following topics:

Networks on Chip
Multi Processor Systems on Chip
Emerging Trends in VLSI
Nanoelectronics: Molecular, Biological and Quantum Computing
MEMS
VLSI Circuits and Systems
System Level Design
Field-programmable & Reconfigurable Systems
System-on-Chip Design
Application-Specific Low Power VLSI System Design
System Issues in Complexity
Low Power
Heat Dissipation, Power Awareness in VLSI Design Test and Verification
Mixed-Signal Design and Analysis
Electrical/Packaging Co-Design
Physical Design
Intellectual property creating and sharing.

__________________________________________________________________________

Important dates are:

Submission Deadline: December 5, 2007 Manuscript, six two-column pages max.
Acceptance Notification: January 15, 2008
Submission of Final Version: February 10, 2008
__________________________________________________________________________

Authors should submit a PDF version of their papers through the web-based
submission interface, as described on the Symposium website.
__________________________________________________________________________

General Chair
Lionel Torres
LIRMM, Montpellier, France
University of Montpellier/CNRS

General Co-Chair
Amar Mukherjee
University of Central Florida, USA

Program Chair
Ian OConnor
Ecole Centrale de Lyon
INL, Lyon, France

Program Co-Chair
Asim Smailagic
Carnegie Mellon University, USA

Publicity Chair (Europe)
Reiner Hartenstein
TU Kaiserslautern, Germany

Publicity Chair (USA)
Don Bouldin
University of Tennessee, USA

Local Chair
Pascal Benoit
LIRMM, Montpellier, France
University of Montpellier/CNRS




----- Fi del missatge reenviat -----


----------------------------------------------------------------

International Conference on IC Design & Technology - Minatec Grenoble, France; June 2nd – June 4th , 2008

	Call for Papers
	Paper Deadline: February 29th, 2008 International Conference on IC Design & Technology Minatec Grenoble, France; June 2nd – June 4 th, 2008 As IC design & process technology continue to advance for increased performance, lower power, and accelerated time-to-market, the engineering activities, traditionally separated along the boundary of design and process technology, will have difficulties in meeting the shrinking window of product optimization tasks. The International Conference on IC Design & Technology provides a forum for engineers, researchers, scientists, professors and students to cross this boundary through interactions of design and process technology on product development & manufacturing. The unique workshop style of the conference provides an opportunity to technologists and product designers to e xchange breakthrough ideas and collaborate effectively. T wo days of technical presentations and workshops will be preceded by a one-day tutorial program of value to both the expert and the beginner. The venue of 2008 ICICDT will be Minatec® – Maison des Micro et Nano Technologies at Grenoble, France: www.icicdt.org Papers are solicited on: •  Design approaches including system, circuit and EDA to manage power, leakage, process variation, signal integrity, reliability, yield, and manufacturability. •  Advanced VLSI design, including processors, ASICs, memories, analog and mixed-signal circuits. •  System-on-Chip (SoC), System-in-Package (SiP), and IP reuse for fast design closure. •  Advanced materials, advanced metallization, and 3D interconnection as both, novel interconnect scheme for future MPUs and approach for realization of SoCs. •  Process and circuit technology for advanced memories: MRAM, FeRAM, PRAM, Nanocrystal Memory, Flash, etc with emphasis on reliability. •  Advanced transistor structures for bulk, multiple Gate, FDSOI, PDSOI, SSOI, SiGe, etc technologies •  RFCMOS characterization, model, simulation for multiple gate technologies •  New gate materials for adjusting Vt, enhanced mobility & scalability, low leakage, and low power. •  SER, thermal, leakage, PID, reliability, yield, etc effects on advanced transistor structures and circuits. •  Simulation & modeling on advanced process, device & circuit. •  Nanotechnology materials, devices and circuits. •  Emerging IC technologies and circuits crossover such as organic IC's, integrated sensors and integrated actuators. Prospective authors are invited to submit a camera-ready paper of maximum four pages in length, including figures and references. The authors should obtain paper submission guidelines from http://www.ICICDT.org. Accepted/Invited papers will be printed in the proceedings of the conference (also available on CD-ROM). Paper submission deadline is February 29, 2008. Conference Format ICICDT features a popular and unique format structured to maximize face-to-face interaction. An abbreviated synopsis of each paper is presented in a plenary session, following which a workshop-style forum allows for deeper give-and-take communication on an individual basis. Many participants in previous years have commented that this interaction is very rewarding. Contact Information For further general information or assistance in selecting a subject area, please contact: •  Organizing Committee: - General chair Tanay Karnik tanay.karnik@intel.com - Conference chair Amara Amara amara.amara@isep.fr - Executive committee chair Thuy Dao thuy.dao@freescale.com - Local arrangement chair Marc Belleville marc.belleville@cea.fr - Publication chair Thomas Ea thomas.ea@isep.fr - Publicity chair Ingo Aller aller@de.ibm.com - Tutorial chair Ali Keshavarzi ali.keshavarzi@intel.com - Treasurer Christine Nora c.nora@ieee.org - Secretary Jean-Luc Leray jean-luc.leray@cea.fr •  Technical Sub-Committee Chairs: Advanced Memory Devices   - Susumu Shuto susumu.shuto@toshiba.co.jp - Jan Ackaert jan_ackaert@amis.com CAD   - Ruchir Puri ruchir@us.ibm.com DFM/DFT/DFR/DFY   - Keith Bowman keith.a.bowman@intel.com - Jason Stinson jason.stinson@intel.com Low Power   - Toshinari Takayanagi ttoshi@pasemi.com - Geoffrey Yeap gyeap@qualcomm.com SoC/MPSoC/SIP, IC & Platform Design and Process   - Aurangzeb Khan - Dac Pham akkhan@cadence.com dac.pham@freescale.com SER   - Giorgio Cellere giorgio.cellere@ieee.org System Level Technology Assessment   - Phillip Christie phillip.christie@nxp.com Emerging Technology   - Simon Deleonibus simon.deleonibus@cea.fr RF & Analog, Mixed signal   - Didier Belot didier.belot@st.com NBTI & High K Gate Reliability   - Koji Eriguchi eriguchi@kuaero.kyoto-u.ac.jp Advanced Materials   - Chadwin Young Chadwin.young@sematech.org Adv. Transistor Structure, Architecture & Process   - Dong-Won Kim - Arnaud Pouydebasque  timo.kim@samsung.com arnaud.pouydebasque@nxpcrolles.st.com

EDA Blog Newsletter

Primary OS Research Posted: 19 Nov 2007 11:15 PM CST According to Venture Development Corporation (VDC), the growing sophistication of embedded devices intensifies competition not only between commercial suppliers, but also in the internal research and development groups within OEMs, which many market players still view as their main competition. VDC expects increasing innovation around hybrid business models as a means to blend the best of both worlds - open source and proprietary - as suppliers continue to adapt and drive their technology innovation through a community at large, increase brand name recognition, and pull through other complementary commercial software product solutions. More info: VDC » Free Trade Publications : : Jobs : : EDA Blog : : FPGA Blog : : Embedded Star : : EDA Geek © 2007 Online Destiny Ltd : : EDA Blog is a trademark of Online Destiny Ltd

News - 2007.11.20 - Early Edition Posted: 19 Nov 2007 11:01 PM CST NEC Develops 40nm Technologies for Embedded DRAM NEC Electronics Corporation and its subsidiaries, NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH, introduced two new technologies for the manufacture of 40-nanometer (nm) system-on-chip (SoC) devices with embedded dynamic random access memory (eDRAM). The UX8GD eDRAM technology boasts clock speeds up to 800 megahertz and low operating power, making it optimal for use in consumer electronics products such as digital video cameras and game consoles. The UX8LD eDRAM technology features low leakage-current levels that reduce power consumption by as much two-thirds compared to equivalent SRAM, making it ideal for use in mobile handsets and other portable devices that require low standby power. Integration Associates Announces Silicon EZDAA with Serial Codec Integration Associates, a pioneering provider of telephony solutions, announced availability of its IA3131/ IA3222, the codec complement to its highly successful EZDAA portfolio. The new product is ideal for the continuing durable market for embedded modems and emerging VoIP markets. Sagantec, Time To Market Partner for IC Design Migration Solutions Sagantec and Time To Market Inc. (TTM) of San Jose, CA, announced a collaboration to jointly deliver complete integrated circuit (IC) design migration solutions. This program offers a variety of unique strategies for re-implementation of existing designs to new process technologies. Free Trade Publications : : Jobs : : EDA Blog : : FPGA Blog : : Embedded Star : : EDA Geek © 2007 Online Destiny Ltd : : EDA Blog is a trademark of Online Destiny Ltd

EDA News - 2007.11.19 Posted: 19 Nov 2007 11:36 AM CST ABI Research Announces Worldwide SIP Services Market Report IP Networks deployed by fixed and mobile operators will lead to mainstream Voice over IP and SIP (Session Initiation Protocol) services, driven by the increasing popularity of “smart” devices such as PDAs and smartphones. ABI Research principal analyst Ian Cox explains, “New affordable price points and ease of use will allow consumers to benefit from SIP services such as instant messaging, video sharing, and conferencing, which will join VoIP as it takes over from circuit-switched voice.” Xirrus Publishes Wi-Fi, Payment Card Industry Compliance Whitepaper Xirrus, Inc., the only provider of high-performance, long-range Wi-Fi products, announced the availability of a new tool and whitepaper explaining the PCI (Payment Card Industry) Data Security Standard for companies that use Wi-Fi and handle payment card information. picoChip Unveils PC6532 WiMAX Wave 2 Femtocell Reference Design picoChip announced the PC6532 Wave 2 femtocell, the next version of its industry-standard WiMAX basestation reference design. Femtocell access points are optimized for deployment inside buildings to improve coverage and data rates. The new PC6532 WiMAX femtocell is the industry’s only single-chip (PHY + MAC) reference design to support WiMAX Wave 2 and full IO-MIMO in both downlink and uplink. ATEME to Showcase Products at Inter BEE 2007 ATEME(TM) SA (Bievres, France), the leading provider of MPEG-4 AVC / H.264 video compression solutions for broadcast and broadband, announced its highlight products for The International Broadcast Equipment Exhibition (Inter BEE), the leading professional show in Japan for audio, video, and communications. Actel Rolls Out Libero Integrated Design Environment v8.1 Extending the company’s industry-leading solutions for saving power at the chip and system levels, Actel Corporation has rolled out its Libero(TM) Integrated Design Environment (IDE) with significant new features, such as power-driven layout, that enable designers to further optimize designs to reduce dynamic power consumption by as much as 30 percent for a typical design. With the advanced power analysis capabilities built into Libero’s SmartPower tool, the enhanced analysis environment is the first to give users a comprehensive understanding of power usage in all functional modes of the design. In addition, an innovative battery life estimation feature gives portable designers an accurate calculation of battery life based on their FPGA design power profile — a first for field-programmable gate array (FPGA) design tools. Freescale Introduces FET for Three-phase Automotive Motor Control Freescale Semiconductor, the leading supplier of semiconductors to the automotive industry, has introduced a versatile field effect transistor (FET) pre-driver designed for three-phase motor control in a wide range of automotive and industrial control applications. CSR Creates Bluetooth MP3 Player Reference Design with Sub $10 eBOM CSR announced the launch of BlueCore Player, the world’s lowest cost Bluetooth enabled MP3 player with an electronic bill of materials (eBOM) of less than $10. Designed for listening to music without cumbersome wires, or for sharing music by streaming to two headsets simultaneously, BlueCore Player also enables direct streaming of MP3 files to reduce power consumption. BlueCore Player is based on CSR’s market leading BlueCore5-Multimedia silicon with embedded DSP coprocessor and 16-bit stereo codec to ensure the high quality stereo sound. MontaVista, Movial Team on Development Solution for Mobile, CE Devices MontaVista Software, Inc., the leading provider of Linux® for intelligent devices and communications infrastructure, and Movial, the company that inspires rich, intuitive Internet experiences, announced a joint solution to accelerate the development cycle and unleash design creativity for developers of consumer electronics and mobile devices. The new joint solution will be optimized for the ARM architecture. Webinar Features MontaVista Linux Carrier Grade Edition 5.0 MontaVista® Software, Inc., the leading provider of Linux® for intelligent devices and communications infrastructure, continues its series of free educational webinars with an overview of new MontaVista Linux Carrier Grade Edition 5.0, the carrier grade Linux operating system preferred by 7 of the top 8 network equipment providers (NEPs). Free Trade Publications : : Jobs : : EDA Blog : : FPGA Blog : : Embedded Star : : EDA Geek © 2007 Online Destiny Ltd : : EDA Blog is a trademark of Online Destiny Ltd

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EDA Blog Newsletter

News - 2007.11.19 - Early Edition Posted: 18 Nov 2007 11:01 PM CST Spreadtrum Communications Acquires Quorum Systems Spreadtrum Communications, Inc. (Nasdaq: SPRD), one of China’s leading wireless baseband chipset providers, announced that it has entered into a definitive agreement to acquire Quorum Systems, Inc. (”Quorum”), a San Diego-based fabless semiconductor company that specializes in the design of highly integrated CMOS radio frequency (RF) transceivers. Under terms of the agreement, Spreadtrum will pay $55 million in cash and $15 million in stock to Quorum’s shareholders, with up to an additional $6 million in cash for performance based earn-outs expected to be achieved over the next two years. Atmel Creates Secure Microcontroller for Mobile Applications Atmel® Corporation (NASDAQ: ATML), announced the introduction of its AT91SC464384RCU, the newest addition to the AT91SC Advanced Telecoms product family. Based on the ARM® SC100, this secure microcontroller targets mobile payment and mobile TV applications. It features an outstanding on-chip compact ROM program memory of 464K Bytes, a flexible 384KB EEPROM for data, and 18KB of RAM. Communication interfaces are ISO7816 and Single Wire Protocol (SWP). VeriFone Secures Retail Payments with Opera Browser VeriFone Holdings, Inc. (NYSE: PAY) announced a strategic partnership with Opera Software ASA to develop a secure payment-enabled version of the Opera Web browser. The browser, being demonstrated for the first time here at Cartes, will operate on VeriFone’s MX800 Series of consumer-facing systems designed for multi-lane retailers, specialty stores, and point-of-service environments such as retail banking, ticketing, or kiosks. Toumaz Receives IET Innovation in Engineering Award Toumaz Technology Limited, the leading provider of ultra-low power wireless infrastructure for body monitoring solutions, won the Electronics category in the Institution of Engineering and Technology’s (IET) prestigious Innovation in Engineering Awards, presented on Tuesday night at a ceremony in The Marriott Grosvenor Square, London, hosted by TV personality and science enthusiast Johnny Ball. FFE Software Unveils FirstSQL/J Embedded Mobile Edition Java Database FFE Software, Inc. announced immediate availability of the first release of its new Java DB — FirstSQL/J Embedded Mobile Edition. Embedded Mobile is a special packaging of the standard FirstSQL/J Java DB for a small footprint, supporting JME and suitable for other embedded configurations. Download FirstSQL/J Embedded Mobile through our Download Page. ADLINK Introduces PCI-8246 GbE PCI-X Card ADLINK Technology introduces the PCI-8246, a 2-port Gigabit Ethernet (GbE) PCI-X card providing bypass capability to directly connect the GbE signals on the two GbE ports when the system is powered down or has crashed. This bypass feature is accomplished by using a mechanical relay array to control the physical routing of the GbE signals using two communication states: normal and bypass. A watchdog timer can be programmed to control the relay switch to automatically enable the bypass mode to ensure a continual network connection in case of system failure. Artesyn Defends Majority of Patent Claims Against Power-One Emerson Network Power, a business of Emerson (NYSE: EMR), announced that its recently acquired Artesyn Technologies successfully defended the majority of a competitor’s claims of patent infringement. Free Trade Publications : : Jobs : : EDA Blog : : FPGA Blog : : Embedded Star : : EDA Geek © 2007 Online Destiny Ltd : : EDA Blog is a trademark of Online Destiny Ltd

Fibre Channel Training Posted: 18 Nov 2007 10:58 AM CST Agilent Technologies Inc. (NYSE: A) and Solution Technology will offer training classes for developers, integrators, and managers for Fibre Channel technology. Solution Technology’s training classes provide participants with an understanding of all aspects of Fibre Channel technology, from fundamentals to architecture. Instructors have deep technical knowledge coupled with real-world experience and understanding of the industry, to help further employee development and company success. Agilent and Solution Technology will offer the public training classes at Agilent’s Santa Clara site throughout the year. The 2008 schedule for the five-day comprehensive Fibre Channel courses is: Feb. 11-15, 2008 Jun. 16-20, 2008 Oct. 20-24, 2008 The training incorporates Agilent’s 173x Series Fibre Channel test tools to support theoretical elements covered. The class offers practical examples and helps illustrate the nature and challenges of this technology. Students also get the opportunity to analyze real systems with Agilent’s protocol debug tools, including the latest standards of 8.5 Gb/s Fibre Channel. The end result is that students understand how to overcome the complexities of Fibre Channel technology and get a head start in their day-to-day job challenges. More info: Agilent Technologies Solution Technology Free Trade Publications : : Jobs : : EDA Blog : : FPGA Blog : : Embedded Star : : EDA Geek © 2007 Online Destiny Ltd : : EDA Blog is a trademark of Online Destiny Ltd

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[Fwd: EDERS 2008 Call for Papers Reminder]

-------- Mensaje original --------

Asunto:	EDERS 2008 Call for Papers Reminder
Fecha:	Mon, 19 Nov 2007 01:02:19 -0500 (EST)
De:	Texas Instruments <tiprime@dlep14.itg.ti.com>
Responder a:	tiprime@dlep14.itg.ti.com
Para:	rodrigo.picos@uib.es

To ensure delivery to your inbox, please add tiprime@dlep14.itg.ti.com to your email address book.

EDERS2008: 3rd European DSP Education and Research Symposium 18th June 2008, Hilton Hotel, Tel Aviv, Israel CALL FOR PAPERS  SUBMISSION DEADLINE 3rd DECEMBER   We are pleased to announce a Call for Papers for the 3rd European DSP Education and Research Symposium (EDERS 2008), to be held in Tel Aviv, Israel on the 18th June 2008.  The European DSP Education and Research Symposium is sponsored by Texas Instruments and co-sponsored by the IEEE Region 8  UK&RI and IEEE Israel Signal Processing Chapters. The event aims to gather DSP Educators, Researchers, and Third-Party Developers from around the world to share their experiences in the use of DSP technology. Accepted papers will describe in detail, critical implementation issues and applications of the latest Texas Instruments digital signal processors. The symposium will comprise oral & poster presentations as well as a small number of demo presentations. We are delighted to announce that the keynote speaker for EDERS 2008 will be Prof Alan Oppenheim from MIT.  An extended summary should be written in English and submitted by email, as a PDF or Microsoft Word document, by the 3rd December 2007 to our secretariat. It should be no longer than two pages. Please indicate whether it is an Education or Research contribution, and include the author's name, address, fixed & mobile phone  numbers, and e-mail address. All papers accepted for presentation will appear in the Symposium Proceedings and may also appear in other publications. Secretariat: Ms. Heather Myers h-myers@ti.com Texas Instruments Deutschland Haggertystrasse 1, D-85356, Freising, Germany Tel: +49 8161 80 4921              Fax: +49 8161 80 3311 Web: http://www.ti.com/europe/eders Key Dates: 3rd Dec. 2007 Extended Summary to be submitted 1st Feb. 2008 Acceptance of Papers to be announced 1st April 2008  Camera Ready Papers to be received 18th June 2008 EDERS 2008 Symposium    Paper Selection Panel Chairman:   Prof. John Soraghan, University of Strathclyde, UK Technical Panel: Prof. Baudoin, ESIEE, France Mr. Bormann, FH Zwickau, Germany Prof. Chambers, Loughborough University, UK Dr. Dahnoun, University of Bristol, UK Associate Prof. Deniz, Eastern Mediterranean University, Turkey Dr. Gannot, Bar-Ilan University, Israel Dr. Jung, University Duisburg-Essen, Germany Prof. Malah, Technion, Israel Prof. Pyndiah, ENST-Bretagne, France Prof. Silven, University of Oulu, Finland Prof. Skodras, Hellenic Open University, Greece Prof. Tortoli, University of Florence, Italy Prof Ur, Tel-Aviv University, Israel Prof. Weiss, TU Graz, Austria Dr. Weiss, University of Strathclyde, UK Prof. Ben-Yaakov, Ben-Gurion University of  the Negev, Israel Prof. Yardimci, Middle East Technical University, Turkey Prof. Yeredor, Tel-Aviv University, Israel Dr. Zetterberg, Royal Institute of Technology, Sweden Associate Prof. Zigouris, Patras University, Greece   Awaiting panel participation confirmation: Associate Prof. Deniz, Eastern Mediterranean University, Turkey Prof. Ur, Tel-Aviv University, Israel Prof. Yardimci, Middle East Technical University, Turkey   Topics of interest include (but are not limited to): Teaching Real-Time Communications Real-Time Multimedia Real-Time Control Other Real-Time Applications When to introduce DSP into the curriculum? Wireless Image & Graphic Processing Digital Control Systems Medical Simulations to Real-Time Systems Broadband Video Processing Industrial Control/Motor Drives Defense DSP Architectures Internet/VOIP Audio Processing Digital Power Management Radar & Sonar Implementation Issues Modems Speech Processing & Recognition Use of IQMath or Digital Motor Control Library Aeronautics & Automotive Monitoring and Assessment Procedures of labs/projects/modules Optical Networking Security and Surveillance   Remote Sensing

 

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