Wednesday, January 9, 2008

13th Symposium on Polymers

The thirteenth meeting of the Symposium on Polymers will be held on May 7th, 8th and 9th of 2008.  The Symposium on Polymers has grown to become one of the most comprehensive technical meetings related to the processing and implementation of polyimides and new polymeric films for advanced microelectronic applications.  This meeting is sponsored by HD MicroSystems LLC, The Electrochemical Society, FUJIFILM Electronic Materials U.S.A., Inc., and JSR Micro, Inc.

TheSymposium on Polymers is held on the grounds of the Winterthur Museum and Gardens in the outlying countryside of Wilmington, Delaware.  This picturesque setting of rolling hills and forests provides a relaxed, intimate setting for the meeting.  The main symposium sessions will be held in the Copeland Lecture Hall in a workshop-like format.  As with prior meetings, ample time will be allotted during breaks and lunch for informal discussions. The symposium poster session, exhibits and a formal dinner for all participants will be held at the DuPont Country Club in nearby Rockland, Delaware.

The program board is soliciting presentations in the following technology areas:

  • Integration of New Polymeric Materials in Microelectronics
  • Processing of Polymer Thin Films
  • New Polymer Materials Technology
  • Structure Property Relationships and Modeling of Polymeric Materials
  • New Polymer Applications

 

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The Symposium on Polymers
for Microelectronics at Winterthur

 

The Symposium on Polymers has been held every 2 years since it was first established in 1988.  The Charter has remained the same: To provide an intimate forum for the exchange of technical information and innovations for the use of thin-film polymeric materials in contemporary microelectronic and new application areas, with a strong emphasis on processing.  The Technical Program Board is pleased to announce the following keynote speakers and topics to be presented at the symposium: 

 

KEYNOTE ADDRESSES

"Advanced Packaging Requirements for Next Generation Processors"
Dr. Raj Master, AMD

"3-D Integration"
Dr. John Knickerbocker, IBM

"Polymer Dielectric Requirements for High Off-Chip Bandwidth"
Dr. Paul Kohl, Georgia Institute of Technology