IEEE SIES 2008 - Montpellier, France - June 11 - 13 - Call for Papers

------------------------------------------------------------------------
| CALL FOR PAPERS |
|-----------------------------------------------------------------------|
| SIES'2008 |
| IEEE Third Symposium on Industrial Embedded Systems |
| June 11- 13, 2008 |
| Montpellier - La Grande Motte, FRANCE |
|-----------------------------------------------------------------------|
Conference web site:

http://www.lirmm.fr/SIES2008/

-----------------------------------------------------------------------

Sponsored by:
IEEE Industrial Electronics Society
LIRMM CNRS/University of Montpellier II

AIM
------------------------------------------------------------------------
The aim of the symposium is to bring together researchers and practitioners
from industry and academia and provide them with a platform to report on
recent developments, deployments, technology trends and research results, as
well as initiatives related to embedded systems and their applications in a
variety of industrial environments.
------------------------------------------------------------------------

BACKGROUND
------------------------------------------------------------------------
Application domains have had a considerable impact on the evolution of
embedded systems, in terms of required methodologies and supporting tools
and resulting technologies. SoCs and SoPC are slowly making inroads into the
area of industrial automation to implement complex field-area intelligent
devices which integrate the intelligent sensor/actuator functionality by
providing on-chip signal conversion, data processing, and communication
functions. There is a growing tendency to network field-area intelligent
devices around industrial type of communication networks. Similar trends
appear in the automotive electronic systems where the Electronic Control
Units, typically implemented as heterogeneous system-on-chip, are networked
by means of one safety-critical communication protocol. The design of this
kind of networked embedded systems (this includes also hard real-time
industrial control systems) is a challenge in itself due to the distributed
nature of processing elements, sharing common communication medium, and
safety-critical requirements, to mention some.
------------------------------------------------------------------------

TOPICS OF INTEREST
------------------------------------------------------------------------
Topics within the scope of the symposium will include, but are not limited
to:
-Embedded Systems
-System-on-Chip and Network-on-Chip Design & Testing
-Networked Embedded Systems
-Embedded Applications
-Multi-Processors Systems-on-Chips
-Sensors networks and ubiquitous computing
-Application of Reconfigurable and Adaptive Systems
-Automotive / Avionics systems
-Fault-tolerant embedded systems and applications
------------------------------------------------------------------------

SOLICITED PAPERS :
------------------------------------------------------------------------
- Long Papers - limited to 8 double column pages.
- Industry Practice (IP)– limited to 8 double column pages.
- Work-in-Progress (WIP)– limited to 4 double column pages.

Manuscripts must be submitted electronically in PDF format, according to the
instructions contained in the Symposium web site.
------------------------------------------------------------------------

AUTHOR'S SCHEDULE (Deadlines):
------------------------------------------------------------------------
Deadline for submission of proposals for long papers: Jan 18, 2008
Notification of acceptance for long papers: Mar 4, 2008
Final manuscripts for long papers submission: Apr 1, 2008

Deadline for WIP and IP papers: Mar 7, 2008
Notification of acceptance of WIP and IP papers: Apr 4, 2008
Final manuscripts of WIP & IP papers submission: Apr 14, 2008
------------------------------------------------------------------------

SPECIAL SESSION ORGANIZATION :
------------------------------------------------------------------------
To enhance the technical program and focus on specific topics and areas, the
SIES'2008 Symposium will include special sessions, in addition to regular
ones. Special sessions can cover subjects or cross-subjects belonging to the
topics of interest, or novel topics related with the ones identified within
the topics of interest. Special sessions can also have the drive from
specific R&D projects or clusters of projects, namely EU-sponsored R&D
projects.
------------------------------------------------------------------------

SIES'2008 COMMITTEES
------------------------------------------------------------------------
General Co-Chairs:
Luis Gomes, Univ. Nova Lisboa, PT
Gilles Sassatelli, LIRMM, CNRS/Univ. Montpellier 2, FR

Program Co-Chairs:
Leandro Indrusiak, Tech. Univ. Darmstadt, DE
Nicolas Navet, LORIA, FR

Work in Progress Co-Chairs:
Luis Almeida, Univ. Aveir, PT
Josep M. Guerrero, UPC, ES

Industry Liaison Committee:
Joao Miguel Fernandes (chair) Univ. Minho PT
Andrea Andenna, ABB Corporate Research, SE
Armando Walter Colombo, Schneider Electric, DE
Jean-Michel Daga, ATMEL Rousset, FR
Vladimir Oplustil, UNIS, CZ
Jean-Pierre Schoellkopf, STM Grenoble, FR

Finance Chair:
Pascal Benoit, LIRMM, FR

International Advisory Committee:
Richard Zurawski, ISA Group, USA (chair)
Marian Adamski, Univ. Zielona Gora, PL
Charles Andre, I3S/UNSA , FR
Juergen Becker, University of Karlsruhe, DE
Giuseppe Buja, University of Padova, IT
Mo-Yuen Chow, North Carolina State University, USA
Carlos Couto, University of Minho, PT
Paul Drews, APS-European Centre for Mechatronics, DE
Leopoldo Franquelo, Universidad de Sevilla, ES
J. David Irwin, Auburn University, USA
Karel Jezernik, Uni. Maribor, SL
Grant Martin, Tensilica, USA
Juan Pimentel, Kettering University, USA
Bogdan Wilamowski Auburn University USA
Francoise Simonot-Lion, LORIA, FR
P. S. Thiagarajan, National Univ. of Singapore, SG
Lionel Torres, LIRMM, FR
Bogdan Wilamowski Auburn University USA
Laurence T. Yang, St. Francis Xavier University, CA
Jing Bing Zhang, SIMTech, SG

Publicity Committee:
Luis Almeida, Univ. Aveiro ,PT
Ricardo Machado, Univ. Minho, PT
José Carlos Metrôlho, I.P.Castelo Branco ,PT
Christer Norstrom, Mälardalen University, SE
Chi-Sheng Shih, National Taiwan University, TW

SIES Series Steering Committee:
Luis Gomes, Univ. Nova Lisboa, PT (chair)
Eric Dekneuvel, I3S/UNSA , FR
James C. Hung, Univ. of Tennessee, USA
Richard Zurawski, ISA Group., USA

IES Information Technology Liaison
Antonio Luque Estepa, Universidad de Sevilla, ES

Publication Chair
Alberto Bosio, LIRMM, FR

Local Organizing Committee
Gilles Sassatelli, LIRMM, FR
Pascal Benoit, LIRMM, FR
Lionel Torres, LIRMM, FR
Nicolas Saint-Jean, LIRMM, FR
Olivier Brousse, LIRMM, FR
Michel Robert, LIRMM, FR
Alberto Bosio, LIRMM, FR

Technical Program Committee
Peter Palensky, TU Wien, AU
Paulo Maciel, Federal University of Pernambuco, BR
Paulo E. Miyagi, University of Sao Paulo, BR
Carlos Eduardo Pereira, Univ. Fed. Rio Grande do Sul, BR
Angelo Perkusich, Federal University of Campina Grande, BR
José Lastra, Tampere University of Technology, FI
Fabrice Muller, I3S UNSA, FR
Marek Wegrzyn, Univ. Zielona Gora, PL
Joao Paulo Barros, I.P.Beja, PT
António Ferrari, Universidade de Aveiro, PT
Valery Sklyarov, Universidade de Aveiro, PT
Joao Cardoso, Instituto Superior Técnico, PT
Carlos Cardeira, Instituto Superior Técnico, PT
Horácio Neto, Instituto Superior Técnico, PT
Luis Bernardo, Universidade Nova de Lisboa, PT
João Goes, Universidade Nova de Lisboa, PT
Zili Shao, Hong Kong Polytechnic University, HK
Alfredo Rosado Muñoz, Universitat de València, ES
Juan-Jose Rodriguez-Andina, Univ. Vigo, ES
Sandeep Shukla, Virginia Tech, USA
Ricardo Machado, Universidade do Minho, PT
Berhnard Schätz, T.U. Munich, DE
Thomas Nolte, MRTC Mälardalen, SE
Chi-Sheng Shih, National Taiwan University, TW
Gianluca Cena, IEIIT-CNR, IT
Anshul Kumar, IIT New-Delhi, IN
Wolfgang A. Halang, FernUniversität Hagen, DE
Jiman Hong, Kwangwoon University, KR
Chin-Long Wey, National Central University Taiwan, TW
Jeen G. Khor, Intel Malaysia Communications Design Center, MY
Sébastien Faucou, Irccyn, FR
Liliana Cucu, Loria, FR
Fernando Moraes, PUCRS, BR
Ian O'Connor, EC Lyon, FR
Luigi Carro, UFRGS, BR
Tanguy Risset, INRIA / ENS Lyon, FR
Falk Salewski, RWTH Aachen University, DE
Laurent George, ECE, FR
Dieter Zöbel, Univ. Koblenz-Landau, DE
Elvinia Riccobene, University of Milan, IT
José Alberto Fonseca, University of Aveiro, PT
Martin Horauer, University of Applied Sciences Technikum Wien, AU
José Barata, Univ. Nova Lisboa, PT
Tei-Wei Kuo, National Taiwan University, TW
Lucia Lo Bello, University of Catania, IT
Shashi Kumar, Jönköping University, SE
Tiberiu Seceleanu, ABB Corporate Research, SE
Peeter Ellervee, Tallinn University of Technology, ET
Adam Pawlak, Silesian University of Technology, PL
Jan Madsen, Technical University of Denmark, DK
Ingo Sander, Royal Institute of Technology, SE
Eduardo de la Torre, Universidad Politécnica de Madrid, ES
Christophe Bobda, University of Potsdam, DE
Bartolomeo Montrucchio, Politecnico di Torino, IT
Kim Sandström, Nokia Research, FI
Achim Rettberg, University of Paderborn, DE
Kenneth Kent, University of New Brunswick, CA
Patrick Schaumont, Virginia Tech, USA
Cesar Ortega-Sanchez, Curtin University of Technology, AUS
Ricardo Jacobi, University of Brasilia, BR
Christoph Grimm, TU Wien, AU
Sofiène Tahar, Concordia University, CA
Michael Huebner, University of Karlsruhe, DE
Jari Nurmi, Tampere University of Technology, FI
Edgar Nett, University of Magdeburg, DE
Enrico Vicario, University of Florence, IT
Iain Bate, University of York, UK
Marisol Garcia-Valls, University Carlos 3 of Madrid, ES
Paulo Pedreiras, University of Aveiro, PT
Arnaldo Oliveira, University of Aveiro, PT
Sergio Yovine, IMAG, FR
Stefan M. Petters, University of New South Wales, AUS
Marco di Natale, santAnna school of advanced studies, IT
Zdenek Hanzalek, Czech Technical University of Prague, CZ
Francoise Simonot-Lion, LORIA, FR
P. S. Thiagarajan, National University of Singapore, SG
Charles Andre, I3S/UNSA, FR
------------------------------------------------------------------------