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Wednesday, February 27, 2008
New Technical T&M Web Seminar: C-V Measurements and Materials Research
Monday, February 25, 2008
ECS - 213th Meeting - Registration Open
REGISTRATION IS NOW OPEN!
213th ECS Meeting
May 18-22, 2008
Phoenix, AZ
For more information and to register, please visit our website: http://www.electrochem.org/.
Please note these important deadlines for the Phoenix Meeting:
1. Meeting and Short Course Registrations are due to ECS Headquarters no later than April 18, 2008 to qualify for the advance registration discount.
Register for the meeting using our online system that processes your Visa, MasterCard, or American Express credit card payment in real time:
https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs.
If you prefer, send or fax a hard copy of your meeting registration forms with payment to The Electrochemical Society, 65 South Main St., Pennington, NJ 08534, USA, Phone: 1.609.737.1902, Fax: 1.609.737.2743, E-mail: ecs@electrochem.org, no later than April 18, 2008. You can download the meeting registration brochure at:
http://www.electrochem.org/meetings/biannual/213/phoenix_reg_bro.pdf.
Please Note: All technical registrations include a copy of the meeting abstracts on CD-ROM only. Attendees who wish to have paper copies of abstracts should download them in advance of the meeting from the ECS website:
http://ecsmeet5.peerx-press.org/jsp/mas/reportSymposiumList.jsp.
2. Hotel reservations are due no later than April 18, 2008!
Located in the center of downtown – steps from the Phoenix Convention Center, Symphony Hall, and Herberger Theater – the Hyatt Regency Phoenix Hotel places you near spectacular sports, arts, culture, and attractions.
A block of rooms have been reserved for May 5-27, 2008. The special room rate will be available until April 18th or until the group block is sold-out, whichever comes first.
Special Room Rates:
$165 per night, per room for single/double occupancy
$215 per night, per room for triple occupancy
$240 per night, per room for quadruple occupancy
Please follow the link to make a hotel room reservation online: http://phoenix.hyatt.com/groupbooking/phxrptels2008
See you at the Hyatt Regency Phoenix in May!
Batteries, Fuel Cells, and Energy Conversion • Biomedical Applications and Organic Electrochemistry • Corrosion, Passivation, and Anodic Films • Dielectric and Semiconductor Materials, Devices, and Processing • Electrochemical/Chemical Deposition and Etching • Electrochemical Synthesis and Engineering • Fullerenes, Nanotubes, and Carbon Nanostructures • Nanotechnology, Nanomaterials, and Nanoscience • Physical and Analytical Electrochemistry • Sensors and Displays: Principles, Materials, and Processing
Tuesday, February 19, 2008
Design News: Volume 8, Issue 7
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 | February 18 2008  |
 |
Feature Story | ||||||||||||
 | There's a new face on ColdFire, and you'll start seeing it on print and online ads in your favorite publications. We've introduced a new microsite for our 15-year-old MCU, freescale.com/coldfire101, that is everything ColdFire, from architecture to training, in an exciting new look. It's fun and informative, and we're out to tell the world about it. |
Knowledge Bank
Educational materials such as presentations, webcasts and white papers
Wind River Seminar: Making Multicore Work
Interested in learning how to maximize your multicore development? Register today for the half-day seminar, Making Multicore Work. We're teaming up with Wind River to present this session across several major European cities. Wind River's multicore architectures and multiprocessing, and the newly announced Freescale MPC8572 PowerQUICC® III communications processor will be featured. Register today.
LTE: Next-gen mobile solutions for bandwidth-intense applications
Flip through the pages of any trade publication and you'll see something written about Long Term Evolution (LTE). Without a question, LTE is hot. And it was on everyone's mind at Mobile World Congress in Barcelona last week.
Engineered to provide high-speed, low-latency data to unlock high-bandwidth applications, LTE is a highly anticipated technology for tomorrow's mobile environment. In Barcelona, we demonstrated LTE feature capabilities, including uplink and downlink at high data rates with streaming HD video.
Most analysts have suggested LTE-enabled consumer devices are at least a year away, yet we're already achieving peak data rates of 96 Mbps downlink and 86 Mbps uplink for mobile devices — and plan to go higher as the standard matures.
Learn more about LTE at www.freescale.com/LTE, and read the press release about our LTE demos from Mobile World Congress.
eeTECHbrief webcast: Connectivity Solutions for Industrial Applications
Are you ready to shorten your 32-bit design time? Freescale's Connectivity Solutions for Industrial Applications eeTECHbrief webcast will help you get started. Gain an understanding of the benefits provided by a single-chip ColdFire® MCU and learn how CodeWarrior® for ColdFire v7.0 simplifies 32-bit designs. You'll also learn about:
- Industry challenges
- The solution – The MCF5223x and MCF5221x ColdFire families
- How these solutions enhance your application
- The development environment – CodeWarrior for ColdFire v7.0
Register at eeTECHbrief.com under "MPU/MCUs" events today. At the end of the webcast you'll receive a coupon code for 50 percent off a demo board.
Newsroom
Press releases from Freescale
Rich Beyer to join Freescale as chairman and CEO
Last week Rich Beyer was named chairman and CEO of Freescale. Beyer succeeds Michel Mayer, who will continue to serve as chairman of the board and CEO until the transition is effective in March. Beyer comes to Freescale from Intersil Corporation. Read more.
| Also see: | "Q&A with Freescale's New CEO" by Emily Thornton (BusinessWeek) |
| "Freescale's new CEO optimistic" by Max Jarman (Arizona Republic) |
Enhancements planned for 3G Mobile eXtreme Convergence reference design
Take Freescale's Mobile eXtreme Convergence (MXC) architecture and then combine it with S60 and Symbian OS™ — and you've got a powerful trio. The three companies created the first HSDPA mobile phone reference design using Freescale's MXC. That design has developed into a mature solution, addressing both upper-low-tier and mid-tier 3G market segments. Freescale continues to enhance the first 3G mobile phone reference design using MXC with S60 and Symbian OS. Design enhancements and cost reductions with the newly-introduced fully-integrated RFCMOS 90nm radio reference design is planned as part of another collaboration with S60 and Symbian. Read more.
Linux community now has integrated Linux BSP for mobile handset applications
The rumor is true. Support for the Linux® operating system on our cellular products is available. Freescale's Linux cellular platform is capable of supporting any Linux Application Framework, whether it's an industry standard or an OEM's proprietary solution. Read more.
Deep packet inspection available for IP-based telecom networks
With telecommunications infrastructure networks becoming more IP-based, network security solutions are even more critical. Together, with Qosmos, we're providing high-performance deep packet inspection solutions using Qosmos' Qoala software on Freescale's MPC8572E PowerQUICC® III processor. The same platform capability will be able to scale from today's dual core MPC8572E to Freescale's innovative multicore platform. Read more.
Partnership helps expand automotive presence in China
China is the second largest automotive market in the world, following only the United States. To create new opportunities in this rapidly growing market, we've formed an alliance with Comtech Group, Inc. We'll focus on using our advanced semiconductor technology in Comtech's customized module solutions, concentrating on its original equipment manufacturing (OEM) and original design manufacturing (ODM) customers in the Chinese automotive market. Read more.
MXC cellular platform supports Microsoft Windows Mobile
Now carriers have the opportunity to deliver desktop "familiarity" through handheld devices. Last week at Mobile World Congress, we announced the integration of the Microsoft Windows Mobile operating system with our Mobile eXtreme Convergence (MXC) cellular platforms. MXC's unique single core modem architecture enables smartphone capabilities at feature-phone prices. Read more.
Product Alerts
Updates about our products, technologies and services
Introducing the industry's most accurate Li-ion battery charger ICs
The industry's most accurate power management ICs that help you get the longest life from your lithium-ion (Li-ion) battery-powered applications have arrived.
Introducing the MC34671, MC34673 and MC34674. These single-input autonomous battery charger ICs offer output voltage accuracy of +/-0.4 percent over temperature and charging current accuracy of +/‑5 percent over temperature. And they can be factory customized to create hundreds of configurations. Read more.
Events
Programs in which Freescale is a host or participant
Add Freescale to your embedded world 2008 agenda
 24-26 February Nuremburg, Germany Hall 9, Stand 335 | Add us to your embedded world 2008 plans. Whether you're designing a consumer appliance, an industrial solution, or just about any kind of embedded application, you can learn from Freescale engineers and experts who will be on site to share their expertise. We're showcasing a wide range of industry-leading solutions and we're presenting several important white paper sessions to help you with your next innovative design. Get all the details. |
My Technical Subscriptions
Current documentation and tool updates
 | Analog and Mixed Signal Network Transceivers LIN, ISO9141, J1850 Physical Interfaces Documentation : Data Sheets MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K System Basis Chip Documentation : Data Sheets MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K |
| DESIGN NEWS ARCHIVE FORWARD TO A COLLEAGUE |
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| © Freescale Semiconductor, Inc. 2004 - 2008. All Rights Reserved |
Monday, February 11, 2008
International Conference on IC Design & Technology - Minatec Grenoble, France; June 2nd – June 4th , 2008
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Thursday, February 7, 2008
SIES 2008 Call for Papers: **Final Deadline Extension for Long Papers: Feb. 18**
Dear All,
Due to numerous late requests, the SIES'2008 long papers deadline has been
postponed to Feb. 18.
-------------------------------------------------------------------------
| CALL FOR PAPERS |
|-----------------------------------------------------------------------|
| SIES'2008 |
| IEEE Third Symposium on Industrial Embedded Systems |
| June 11- 13, 2008 |
| Montpellier - La Grande Motte, FRANCE |
|-----------------------------------------------------------------------|
Conference web site:
-----------------------------------------------------------------------
Sponsored by:
IEEE Industrial Electronics Society
LIRMM CNRS/University of Montpellier II
AIM
------------------------------------------------------------------------
The aim of the symposium is to bring together researchers and practitioners
from industry and academia and provide them with a platform to report on
recent developments, deployments, technology trends and research results, as
well as initiatives related to embedded systems and their applications in a
variety of industrial environments.
------------------------------------------------------------------------
BACKGROUND
------------------------------------------------------------------------
Application domains have had a considerable impact on the evolution of
embedded systems, in terms of required methodologies and supporting tools
and resulting technologies. SoCs and SoPC are slowly making inroads into the
area of industrial automation to implement complex field-area intelligent
devices which integrate the intelligent sensor/actuator functionality by
providing on-chip signal conversion, data processing, and communication
functions. There is a growing tendency to network field-area intelligent
devices around industrial type of communication networks. Similar trends
appear in the automotive electronic systems where the Electronic Control
Units, typically implemented as heterogeneous system-on-chip, are networked
by means of one safety-critical communication protocol. The design of this
kind of networked embedded systems (this includes also hard real-time
industrial control systems) is a challenge in itself due to the distributed
nature of processing elements, sharing common communication medium, and
safety-critical requirements, to mention some.
------------------------------------------------------------------------
TOPICS OF INTEREST
------------------------------------------------------------------------
Topics within the scope of the symposium will include, but are not limited
to:
-Embedded Systems
-System-on-Chip and Network-on-Chip Design & Testing
-Networked Embedded Systems
-Embedded Applications
-Multi-Processors Systems-on-Chips
-Sensors networks and ubiquitous computing
-Application of Reconfigurable and Adaptive Systems
-Automotive / Avionics systems
-Fault-tolerant embedded systems and applications
------------------------------------------------------------------------
SOLICITED PAPERS :
------------------------------------------------------------------------
- Long Papers - limited to 8 double column pages.
- Industry Practice (IP)– limited to 8 double column pages.
- Work-in-Progress (WIP)– limited to 4 double column pages.
Manuscripts must be submitted electronically in PDF format, according to the
instructions contained in the Symposium web site.
------------------------------------------------------------------------
AUTHOR'S SCHEDULE (Deadlines):
------------------------------------------------------------------------
Deadline for submission of proposals for long papers: Feb 18, 2008 **FINAL
DEADLINE EXTENSION**
Notification of acceptance for long papers: Apr 1,2008
Final manuscripts for long papers submission: Apr 22,2008
Deadline for WIP and IP papers: Mar 28, 2008
**EXTENDED DEADLINE**
Notification of acceptance of WIP and IP papers: Apr 25, 2008
Final manuscripts of WIP & IP papers submission: May 2, 2008
------------------------------------------------------------------------
SPECIAL SESSION ORGANIZATION :
------------------------------------------------------------------------
To enhance the technical program and focus on specific topics and areas, the
SIES'2008 Symposium will include special sessions, in addition to regular
ones. Special sessions can cover subjects or cross-subjects belonging to the
topics of interest, or novel topics related with the ones identified within
the topics of interest. Special sessions can also have the drive from
specific R&D projects or clusters of projects, namely EU-sponsored R&D
projects.
------------------------------------------------------------------------
SIES'2008 COMMITTEES
------------------------------------------------------------------------
General Co-Chairs:
Luis Gomes, Univ. Nova Lisboa, PT
Gilles Sassatelli, LIRMM, CNRS/Univ. Montpellier 2, FR
Program Co-Chairs:
Leandro Indrusiak, Tech. Univ. Darmstadt, DE
Nicolas Navet, LORIA, FR
Work in Progress Co-Chairs:
Luis Almeida, Univ. Aveir, PT
Josep M. Guerrero, UPC, ES
Industry Liaison Committee:
Joao Miguel Fernandes (chair) Univ. Minho PT
Andrea Andenna, ABB Corporate Research, SE
Armando Walter Colombo, Schneider Electric, DE
Jean-Pierre Schoellkopf, STM Grenoble, FR
Jean-Michel Daga, ATMEL Rousset, FR
Vladimir Oplustil, UNIS, CZ
Finance Chair:
Pascal Benoit, LIRMM, FR
International Advisory Committee:
Richard Zurawski, ISA Group, USA (chair)
Bogdan Wilamowski Auburn University USA
Carlos Couto, University of Minho, PT
Charles Andre, I3S/UNSA , FR
Francoise Simonot-Lion, LORIA, FR
Giuseppe Buja, University of Padova, IT
Grant Martin, Tensilica, USA
J. David Irwin, Auburn University, USA
Jing Bing Zhang, SIMTech, SG
Juan Pimentel, Kettering University, USA
Juergen Becker, University of Karlsruhe, DE
Karel Jezernik, Uni. Maribor, SL
Laurence T. Yang, St. Francis Xavier University, CA
Leopoldo Franquelo, Universidad de Sevilla, ES
Lionel Torres, LIRMM, FR
Marian Adamski, Univ. Zielona Gora, PL
Mo-Yuen Chow, North Carolina State University, USA
P. S. Thiagarajan, National Univ. of Singapore, SG
Paul Drews, APS-European Centre for Mechatronics, DE
Publicity Committee:
Christer Norstrom, Mälardalen University, SE
Chi-Sheng Shih, National Taiwan University, TW
José Carlos Metrôlho, I.P.Castelo Branco ,PT
Luis Almeida, Univ. Aveiro ,PT
Ricardo Machado, Univ. Minho, PT
SIES Series Steering Committee:
Luis Gomes, Univ. Nova Lisboa, PT (chair)
Eric Dekneuvel, I3S/UNSA , FR
James C. Hung, Univ. of Tennessee, USA
Richard Zurawski, ISA Group., USA
IES Information Technology Liaison
Antonio Luque Estepa, Universidad de Sevilla, ES
Publication Chair
Alberto Bosio, LIRMM, FR
Local Organizing Committee
Gilles Sassatelli, LIRMM, FR
Pascal Benoit, LIRMM, FR
Lionel Torres, LIRMM, FR
Nicolas Saint-Jean, LIRMM, FR
Olivier Brousse, LIRMM, FR
Michel Robert, LIRMM, FR
Alberto Bosio, LIRMM, FR
Technical Program Committee
Achim Rettberg, University of Paderborn, DE
Adam Pawlak, Silesian University of Technology, PL
Alfredo Rosado Muñoz, Universitat de València, ES
Angelo Perkusich, Federal University of Campina Grande, BR
Anshul Kumar, IIT New-Delhi, IN
António Ferrari, Universidade de Aveiro, PT
Arnaldo Oliveira, University of Aveiro, PT
Bartolomeo Montrucchio, Politecnico di Torino, IT
Berhnard Schätz, T.U. Munich, DE
Carlos Cardeira, Instituto Superior Técnico, PT
Carlos Eduardo Pereira, Univ. Fed. Rio Grande do Sul, BR
Cesar Ortega-Sanchez, Curtin University of Technology, AUS
Charles Andre, I3S/UNSA, FR
Chin-Long Wey, National Central University Taiwan, TW
Chi-Sheng Shih, National Taiwan University, TW
Christoph Grimm, TU Wien, AU
Christophe Bobda, University of Potsdam, DE
Dieter Zöbel, Univ. Koblenz-Landau, DE
Edgar Nett, University of Magdeburg, DE
Eduardo de la Torre, Universidad Politécnica de Madrid, ES
Elvinia Riccobene, University of Milan, IT
Enrico Vicario, University of Florence, IT
Fabrice Muller, I3S UNSA, FR
Falk Salewski, RWTH Aachen University, DE
Fernando Moraes, PUCRS, BR
Francoise Simonot-Lion, LORIA, FR
Gianluca Cena, IEIIT-CNR, IT
Horácio Neto, Instituto Superior Técnico, PT
Iain Bate, University of York, UK
Ian O'Connor, EC Lyon, FR
Ingo Sander, Royal Institute of Technology, SE
Jan Madsen, Technical University of Denmark, DK
Jari Nurmi, Tampere University of Technology, FI
Jeen G. Khor, Intel Malaysia Communications Design Center, MY
Jiman Hong, Kwangwoon University, KR
Joao Cardoso, Instituto Superior Técnico, PT
João Goes, Universidade Nova de Lisboa, PT
Joao Paulo Barros, I.P.Beja, PT
José Alberto Fonseca, University of Aveiro, PT
José Barata, Univ. Nova Lisboa, PT
José Lastra, Tampere University of Technology, FI
Juan-Jose Rodriguez-Andina, Univ. Vigo, ES
Kenneth Kent, University of New Brunswick, CA
Kim Sandström, Nokia Research, FI
Laurent George, ECE, FR
Liliana Cucu, Loria, FR
Lucia Lo Bello, University of Catania, IT
Luigi Carro, UFRGS, BR
Luis Bernardo, Universidade Nova de Lisboa, PT
Marco di Natale, santAnna school of advanced studies, IT
Marek Wegrzyn, Univ. Zielona Gora, PL
Marisol Garcia-Valls, University Carlos 3 of Madrid, ES
Martin Horauer, University of Applied Sciences Technikum Wien, AU
Michael Huebner, University of Karlsruhe, DE
P. S. Thiagarajan, National University of Singapore, SG
Patrick Schaumont, Virginia Tech, USA
Paulo E. Miyagi, University of Sao Paulo, BR
Paulo Maciel, Federal University of Pernambuco, BR
Paulo Pedreiras, University of Aveiro, PT
Peeter Ellervee, Tallinn University of Technology, ET
Peter Palensky, TU Wien, AU
Ricardo Jacobi, University of Brasilia, BR
Ricardo Machado, Universidade do Minho, PT
Sandeep Shukla, Virginia Tech, USA
Sébastien Faucou, Irccyn, FR
Sergio Yovine, IMAG, FR
Shashi Kumar, Jönköping University, SE
Sofiène Tahar, Concordia University, CA
Stefan M. Petters, NICTA, AUS
Tanguy Risset, INRIA / ENS Lyon, FR
Tei-Wei Kuo, National Taiwan University, TW
Thomas Nolte, MRTC Mälardalen, SE
Tiberiu Seceleanu, ABB Corporate Research, SE
Valery Sklyarov, Universidade de Aveiro, PT
Wolfgang A. Halang, FernUniversität Hagen, DE
Zdenek Hanzalek, Czech Technical University of Prague, CZ
Zili Shao, Hong Kong Polytechnic University, HK
------------------------------------------------------------------------
