Dear All,
Due to numerous late requests, the SIES'2008 long papers deadline has been
postponed to Feb. 18.
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| CALL FOR PAPERS |
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| SIES'2008 |
| IEEE Third Symposium on Industrial Embedded Systems |
| June 11- 13, 2008 |
| Montpellier - La Grande Motte, FRANCE |
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Conference web site:
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Sponsored by:
IEEE Industrial Electronics Society
LIRMM CNRS/University of Montpellier II
AIM
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The aim of the symposium is to bring together researchers and practitioners
from industry and academia and provide them with a platform to report on
recent developments, deployments, technology trends and research results, as
well as initiatives related to embedded systems and their applications in a
variety of industrial environments.
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BACKGROUND
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Application domains have had a considerable impact on the evolution of
embedded systems, in terms of required methodologies and supporting tools
and resulting technologies. SoCs and SoPC are slowly making inroads into the
area of industrial automation to implement complex field-area intelligent
devices which integrate the intelligent sensor/actuator functionality by
providing on-chip signal conversion, data processing, and communication
functions. There is a growing tendency to network field-area intelligent
devices around industrial type of communication networks. Similar trends
appear in the automotive electronic systems where the Electronic Control
Units, typically implemented as heterogeneous system-on-chip, are networked
by means of one safety-critical communication protocol. The design of this
kind of networked embedded systems (this includes also hard real-time
industrial control systems) is a challenge in itself due to the distributed
nature of processing elements, sharing common communication medium, and
safety-critical requirements, to mention some.
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TOPICS OF INTEREST
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Topics within the scope of the symposium will include, but are not limited
to:
-Embedded Systems
-System-on-Chip and Network-on-Chip Design & Testing
-Networked Embedded Systems
-Embedded Applications
-Multi-Processors Systems-on-Chips
-Sensors networks and ubiquitous computing
-Application of Reconfigurable and Adaptive Systems
-Automotive / Avionics systems
-Fault-tolerant embedded systems and applications
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SOLICITED PAPERS :
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- Long Papers - limited to 8 double column pages.
- Industry Practice (IP)– limited to 8 double column pages.
- Work-in-Progress (WIP)– limited to 4 double column pages.
Manuscripts must be submitted electronically in PDF format, according to the
instructions contained in the Symposium web site.
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AUTHOR'S SCHEDULE (Deadlines):
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Deadline for submission of proposals for long papers: Feb 18, 2008 **FINAL
DEADLINE EXTENSION**
Notification of acceptance for long papers: Apr 1,2008
Final manuscripts for long papers submission: Apr 22,2008
Deadline for WIP and IP papers: Mar 28, 2008
**EXTENDED DEADLINE**
Notification of acceptance of WIP and IP papers: Apr 25, 2008
Final manuscripts of WIP & IP papers submission: May 2, 2008
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SPECIAL SESSION ORGANIZATION :
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To enhance the technical program and focus on specific topics and areas, the
SIES'2008 Symposium will include special sessions, in addition to regular
ones. Special sessions can cover subjects or cross-subjects belonging to the
topics of interest, or novel topics related with the ones identified within
the topics of interest. Special sessions can also have the drive from
specific R&D projects or clusters of projects, namely EU-sponsored R&D
projects.
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SIES'2008 COMMITTEES
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General Co-Chairs:
Luis Gomes, Univ. Nova Lisboa, PT
Gilles Sassatelli, LIRMM, CNRS/Univ. Montpellier 2, FR
Program Co-Chairs:
Leandro Indrusiak, Tech. Univ. Darmstadt, DE
Nicolas Navet, LORIA, FR
Work in Progress Co-Chairs:
Luis Almeida, Univ. Aveir, PT
Josep M. Guerrero, UPC, ES
Industry Liaison Committee:
Joao Miguel Fernandes (chair) Univ. Minho PT
Andrea Andenna, ABB Corporate Research, SE
Armando Walter Colombo, Schneider Electric, DE
Jean-Pierre Schoellkopf, STM Grenoble, FR
Jean-Michel Daga, ATMEL Rousset, FR
Vladimir Oplustil, UNIS, CZ
Finance Chair:
Pascal Benoit, LIRMM, FR
International Advisory Committee:
Richard Zurawski, ISA Group, USA (chair)
Bogdan Wilamowski Auburn University USA
Carlos Couto, University of Minho, PT
Charles Andre, I3S/UNSA , FR
Francoise Simonot-Lion, LORIA, FR
Giuseppe Buja, University of Padova, IT
Grant Martin, Tensilica, USA
J. David Irwin, Auburn University, USA
Jing Bing Zhang, SIMTech, SG
Juan Pimentel, Kettering University, USA
Juergen Becker, University of Karlsruhe, DE
Karel Jezernik, Uni. Maribor, SL
Laurence T. Yang, St. Francis Xavier University, CA
Leopoldo Franquelo, Universidad de Sevilla, ES
Lionel Torres, LIRMM, FR
Marian Adamski, Univ. Zielona Gora, PL
Mo-Yuen Chow, North Carolina State University, USA
P. S. Thiagarajan, National Univ. of Singapore, SG
Paul Drews, APS-European Centre for Mechatronics, DE
Publicity Committee:
Christer Norstrom, Mälardalen University, SE
Chi-Sheng Shih, National Taiwan University, TW
José Carlos Metrôlho, I.P.Castelo Branco ,PT
Luis Almeida, Univ. Aveiro ,PT
Ricardo Machado, Univ. Minho, PT
SIES Series Steering Committee:
Luis Gomes, Univ. Nova Lisboa, PT (chair)
Eric Dekneuvel, I3S/UNSA , FR
James C. Hung, Univ. of Tennessee, USA
Richard Zurawski, ISA Group., USA
IES Information Technology Liaison
Antonio Luque Estepa, Universidad de Sevilla, ES
Publication Chair
Alberto Bosio, LIRMM, FR
Local Organizing Committee
Gilles Sassatelli, LIRMM, FR
Pascal Benoit, LIRMM, FR
Lionel Torres, LIRMM, FR
Nicolas Saint-Jean, LIRMM, FR
Olivier Brousse, LIRMM, FR
Michel Robert, LIRMM, FR
Alberto Bosio, LIRMM, FR
Technical Program Committee
Achim Rettberg, University of Paderborn, DE
Adam Pawlak, Silesian University of Technology, PL
Alfredo Rosado Muñoz, Universitat de València, ES
Angelo Perkusich, Federal University of Campina Grande, BR
Anshul Kumar, IIT New-Delhi, IN
António Ferrari, Universidade de Aveiro, PT
Arnaldo Oliveira, University of Aveiro, PT
Bartolomeo Montrucchio, Politecnico di Torino, IT
Berhnard Schätz, T.U. Munich, DE
Carlos Cardeira, Instituto Superior Técnico, PT
Carlos Eduardo Pereira, Univ. Fed. Rio Grande do Sul, BR
Cesar Ortega-Sanchez, Curtin University of Technology, AUS
Charles Andre, I3S/UNSA, FR
Chin-Long Wey, National Central University Taiwan, TW
Chi-Sheng Shih, National Taiwan University, TW
Christoph Grimm, TU Wien, AU
Christophe Bobda, University of Potsdam, DE
Dieter Zöbel, Univ. Koblenz-Landau, DE
Edgar Nett, University of Magdeburg, DE
Eduardo de la Torre, Universidad Politécnica de Madrid, ES
Elvinia Riccobene, University of Milan, IT
Enrico Vicario, University of Florence, IT
Fabrice Muller, I3S UNSA, FR
Falk Salewski, RWTH Aachen University, DE
Fernando Moraes, PUCRS, BR
Francoise Simonot-Lion, LORIA, FR
Gianluca Cena, IEIIT-CNR, IT
Horácio Neto, Instituto Superior Técnico, PT
Iain Bate, University of York, UK
Ian O'Connor, EC Lyon, FR
Ingo Sander, Royal Institute of Technology, SE
Jan Madsen, Technical University of Denmark, DK
Jari Nurmi, Tampere University of Technology, FI
Jeen G. Khor, Intel Malaysia Communications Design Center, MY
Jiman Hong, Kwangwoon University, KR
Joao Cardoso, Instituto Superior Técnico, PT
João Goes, Universidade Nova de Lisboa, PT
Joao Paulo Barros, I.P.Beja, PT
José Alberto Fonseca, University of Aveiro, PT
José Barata, Univ. Nova Lisboa, PT
José Lastra, Tampere University of Technology, FI
Juan-Jose Rodriguez-Andina, Univ. Vigo, ES
Kenneth Kent, University of New Brunswick, CA
Kim Sandström, Nokia Research, FI
Laurent George, ECE, FR
Liliana Cucu, Loria, FR
Lucia Lo Bello, University of Catania, IT
Luigi Carro, UFRGS, BR
Luis Bernardo, Universidade Nova de Lisboa, PT
Marco di Natale, santAnna school of advanced studies, IT
Marek Wegrzyn, Univ. Zielona Gora, PL
Marisol Garcia-Valls, University Carlos 3 of Madrid, ES
Martin Horauer, University of Applied Sciences Technikum Wien, AU
Michael Huebner, University of Karlsruhe, DE
P. S. Thiagarajan, National University of Singapore, SG
Patrick Schaumont, Virginia Tech, USA
Paulo E. Miyagi, University of Sao Paulo, BR
Paulo Maciel, Federal University of Pernambuco, BR
Paulo Pedreiras, University of Aveiro, PT
Peeter Ellervee, Tallinn University of Technology, ET
Peter Palensky, TU Wien, AU
Ricardo Jacobi, University of Brasilia, BR
Ricardo Machado, Universidade do Minho, PT
Sandeep Shukla, Virginia Tech, USA
Sébastien Faucou, Irccyn, FR
Sergio Yovine, IMAG, FR
Shashi Kumar, Jönköping University, SE
Sofiène Tahar, Concordia University, CA
Stefan M. Petters, NICTA, AUS
Tanguy Risset, INRIA / ENS Lyon, FR
Tei-Wei Kuo, National Taiwan University, TW
Thomas Nolte, MRTC Mälardalen, SE
Tiberiu Seceleanu, ABB Corporate Research, SE
Valery Sklyarov, Universidade de Aveiro, PT
Wolfgang A. Halang, FernUniversität Hagen, DE
Zdenek Hanzalek, Czech Technical University of Prague, CZ
Zili Shao, Hong Kong Polytechnic University, HK
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